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5962-0051205Q2A PDF预览

5962-0051205Q2A

更新时间: 2024-02-04 11:31:08
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路输出元件输入元件
页数 文件大小 规格书
58页 1455K
描述
FAMILY OF LOW-POWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

5962-0051205Q2A 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:QLCC
包装说明:CERAMIC, LCC-20针数:20
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:1 week
风险等级:5.84Is Samacsys:N
放大器类型:OPERATIONAL AMPLIFIER架构:VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB):0.075 µA25C 时的最大偏置电流 (IIB):0.014 µA
标称共模抑制比:80 dB频率补偿:YES
最大输入失调电压:2200 µVJESD-30 代码:S-CQCC-N20
长度:8.89 mm低-偏置:NO
低-失调:NO微功率:NO
功能数量:2端子数量:20
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QCCN
封装等效代码:LCC20,.35SQ封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
功率:NO电源:+-1.35/+-3/2.7/6 V
可编程功率:NO认证状态:Not Qualified
筛选级别:MIL-PRF-38535 Class Q座面最大高度:2.03 mm
最小摆率:0.8 V/us标称压摆率:1.6 V/us
子类别:Operational Amplifier最大压摆率:2 mA
供电电压上限:6 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:NO LEAD
端子节距:1.27 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED标称均一增益带宽:5200 kHz
最小电压增益:28000宽带:NO
宽度:8.89 mmBase Number Matches:1

5962-0051205Q2A 数据手册

 浏览型号5962-0051205Q2A的Datasheet PDF文件第1页浏览型号5962-0051205Q2A的Datasheet PDF文件第2页浏览型号5962-0051205Q2A的Datasheet PDF文件第4页浏览型号5962-0051205Q2A的Datasheet PDF文件第5页浏览型号5962-0051205Q2A的Datasheet PDF文件第6页浏览型号5962-0051205Q2A的Datasheet PDF文件第7页 
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀꢁꢂꢃ ꢄ ꢅ ꢈ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢃ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢉ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢊ ꢇ ꢀꢁꢂ ꢃꢄ ꢅꢋ ꢌ  
ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑ ꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ  
ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ  
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004  
TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
SMALL  
OUTLINE  
(D)  
SMALL  
OUTLINE  
(PW)  
CERAMIC  
DIP  
CERAMIC  
FLATPACK  
(U)  
CHIP CAR-  
RIER  
IO  
T
A
CERAMIC DIP  
(JG)  
AT 25°C  
(J)  
(FK)  
TLV2462QD  
TLV2463QD  
TLV2462QPW  
TLV2463QPW  
2000 µV  
1500 µV  
2000 µV  
1500 µV  
40°C to 125°C  
TLV2462AQD  
TLV2463AQD  
TLV2462AQPW  
TLV2463AQPW  
TLV2462MJG  
TLV2462MU  
TLV2462MFK  
TLV2463MFK  
TLV2463MJ  
−55°C to 125°C  
TLV2462AMJG  
TLV2462AMU  
TLV2462AMFK  
TLV2463AMFK  
TLV2463AMJ  
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR).  
TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
IO  
T
SMALL OUTLINE  
(D)  
PLASTIC DIP  
(N)  
TSSOP  
(PW)  
A
AT 25°C  
2000 µV  
2000 µV  
1500 µV  
TLV2464CD  
TLV2465CD  
TLV2464CN  
TLV2465CN  
TLV2464CPW  
TLV2465CPW  
0°C to 70°C  
TLV2464ID  
TLV2465ID  
TLV2464IN  
TLV2465IN  
TLV2464IPW  
TLV2465IPW  
40°C to 125°C  
TLV2464AID  
TLV2465AID  
TLV2464AIN  
TLV2465AIN  
TLV2464AIPW  
TLV2465AIPW  
This package is available taped and reeled. To order this packaging option, add an R suffix to the part  
number(e.g., TLV2464CDR).  
Chip forms are tested at T = 25°C only.  
A
TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS  
PACKAGED DEVICES  
SMALL  
V
IO  
max  
SMALL  
OUTLINE  
(D)  
T
A
CERAMIC DIP  
CHIP CARRIER  
(FK)  
AT 25°C  
OUTLINE  
(PW)  
(J)  
TLV2464QD  
TLV2465QD  
TLV2464QPW  
TLV2465QPW  
2000 µV  
1500 µV  
2000 µV  
1500 µV  
-40°C to 125°C  
TLV2464AQD  
TLV2465AQD  
TLV2464AQPW  
TLV2465AQPW  
TLV2464MJ  
TLV2465MJ  
TLV2464MFK  
TLV2465MFK  
−55°C to 125°C  
TLV2464AMJ  
TLV2465AMJ  
TLV2464AMFK  
TLV2465AMFK  
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number  
(e.g., TLV2464QDR).  
3
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