Datasheet > 55714-002

55714-002

更新时间： 2024-02-17 23:46:27

品牌	Logo	应用领域
安费诺 - AMPHENOL		连接器
页数	文件大小	规格书
6页	253K
描述
Board Stacking Connector, 81 Contact(s), 9 Row(s), Male, Straight, Surface Mount Terminal, Plug,

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55714-002 技术参数

是否Rohs认证：	符合	生命周期：	Active
包装说明：	ROHS COMPLIANT	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8536.69.40.40
Factory Lead Time：	6 weeks	风险等级：	1.82
主体/外壳类型：	PLUG	连接器类型：	BOARD STACKING CONNECTOR
联系完成配合：	NOT SPECIFIED	联系完成终止：	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
触点性别：	MALE	触点材料：	NOT SPECIFIED
DIN 符合性：	NO	滤波功能：	NO
IEC 符合性：	NO	JESD-609代码：	e1
MIL 符合性：	NO	插接信息：	MULTIPLE MATING PARTS AVAILABLE
混合触点：	NO	安装方式：	STRAIGHT
安装类型：	BOARD	装载的行数：	9
选件：	GENERAL PURPOSE	端子节距：	1.27 mm
端接类型：	SURFACE MOUNT	触点总数：	81
Base Number Matches：	1

55714-002 数据手册

boarD to boarD connEctors

MEG-ARRAY^®MEZZANINE CONNECTOR SYSTEM

HiGH DEnsity, bGa DEsiGn EXcEls at HiGH spEED pErForMancE anD rEliability

DEscription

The MEG-Array Mezzanine Connector

system provides the high density and high

speed beneﬁts of a large array supported by

the reliability and low costs of standard surface

mount PCB assembly.

1.27mm x 1.27mm array of discrete circuit

contacts allows ﬂexible ground distribution to

optimize high speed signal integrity at speeds

exceeding 10 Gb/s. MEG-Array is offered in a

variety of PCB mezzanine stack heights.

FCI’s advanced manufacturing supports a

patented BGA interconnect design. Multiple

in-process vision systems monitor BGA contact

integrity including solder sphere size, location

and co-planarity plus other critical-to-function

attributes.

tarGEt MarkEts /

applications

FEaturEs & bEnEFits

High density, high speed, discrete contact, array connector

Flexible ground distribution optimizes high speed signal integrity

10 Gb/s differential pair performance with under 1% cross-talk

28 Gb/s high speed performance documented for 4mm and 6mm

stack height

COMMUNICATIONS

Transmission

Access

Switching

Online s-parameter ﬁles and signal integrity performance reports

improve design accuracy and time-to-market

Optics

1.27mm x 1.27mm grid provides 71 contacts per cm2 density to

save space

Networking

DATA

Wide range of sizes and PCB stack heights increase mechanical

design ﬂexibility

Servers

Storage

6 PCB Stack heights: 4mm to 14mm

8 sizes: 81 to 528 positions

I & I

Revolutionary, trusted BGA interconnect platform

High density standard BGA attachment lowers assembly costs by

using standard SMT processes

Industrial controls & equipment

Analytical & diagnostic

Medical

BGA natural surface tension provides self-alignment and self-leveling

for multiple connector usage

Patented BGA contact attachment preserves solder ball positioning

Optimized PCB routing enhances electrical performance

Quality and Reliability

Time-tested reliability record includes Telcordia GR-1217-CORE and

NPS-25298-2 options

22+ year solder joint reliability per IPC-SM-785

17 Billion + lines shipped to customer satisfaction

Precious metal plating options satisfy varying customer needs for

environmental resistance

12 3 4 5 6

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与55714-002相关器件

型号	品牌	描述	获取价格	数据表
55714-002LF	AMPHENOL	Board Stacking Connector, 81 Contact(s), 9 Row(s), Male, Straight, Surface Mount Terminal,	获取价格
557-1402-203	DIALIGHT	LED Panel Mount Indicator 11/16 Mounting Hole, Watertight	获取价格
557-140AB	OHMITE	Heat Sink	获取价格
55714-102	AMPHENOL	Board Stacking Connector, 81 Contact(s), 9 Row(s), Male, Straight, Surface Mount Terminal,	获取价格
55714-102LF	AMPHENOL	Board Stacking Connector, 81 Contact(s), 9 Row(s), Male, Straight, Surface Mount Terminal,	获取价格
557-1412-203	DIALIGHT	LED Panel Mount Indicator 11/16 Mounting Hole, Watertight	获取价格

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