Datasheet > 530HB156M250DG

530HB156M250DG

更新时间： 2024-02-25 07:24:39

品牌	Logo	应用领域
芯科 - SILICON		石英晶振
页数	文件大小	规格书
12页	453K
描述
XO, Clock, 10MHz Min, 945MHz Max, 156.25MHz Nom

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530HB156M250DG 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	DILCC6,.2
Reach Compliance Code：	compliant	风险等级：	5.71
JESD-609代码：	e3	安装特点：	SURFACE MOUNT
端子数量：	6	最大工作频率：	945 MHz
最小工作频率：	10 MHz	标称工作频率：	156.25 MHz
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装等效代码：	DILCC6,.2
电源：	2.5 V	认证状态：	Not Qualified
子类别：	Other Oscillators	最大压摆率：	108 mA
标称供电电压：	2.5 V	表面贴装：	YES
端子面层：	Matte Tin (Sn)	Base Number Matches：	1

530HB156M250DG 数据手册

Si530/531

Table 7. Environmental Compliance

The Si530/531 meets the following qualification test requirements.

Parameter

Mechanical Shock

Conditions/Test Method

MIL-STD-883, Method 2002

MIL-STD-883, Method 2007

MIL-STD-883, Method 2003

MIL-STD-883, Method 1014

MIL-STD-883, Method 2036

J-STD-020, MSL1

Mechanical Vibration

Solderability

Gross & Fine Leak

Resistance to Solder Heat

Moisture Sensitivity Level

Contact Pads

Gold over Nickel

Table 8. Thermal Characteristics

(Typical values TA = 25 ºC, V_DD= 3.3 V)

Parameter

Symbol

Test Condition

Still Air

Min

—

Typ

84.6

38.8

—

Max

—

Unit

°C/W

°C

Thermal Resistance Junction to Ambient

Thermal Resistance Junction to Case

Ambient Temperature



Still Air

—

–40

—

Junction Temperature

—

125

°C

Table 9. Absolute Maximum Ratings¹

Parameter

Maximum Operating Temperature

Supply Voltage, 1.8 V Option

Symbol

Rating

Unit

ºC

AMAX

–0.5 to +1.9

–0.5 to +3.8

Supply Voltage, 2.5/3.3 V Option

Input Voltage (any input pin)

–0.5 to V + 0.3

Storage Temperature

–55 to +125

2500

ºC

ESD Sensitivity (HBM, per JESD22-A114)

Soldering Temperature (Pb-free profile)²

ESD

260

ºC

PEAK

Soldering Temperature Time @ T_PEAK(Pb-free profile)²

20–40

seconds

Notes:

1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional

operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for

extended periods may affect device reliability.

2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at

www.silabs.com/VCXO for further information, including soldering profiles.

Rev. 1.5

1 2 3 456 7 8...12

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