是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8536.90.40.00 |
风险等级: | 5.25 | 其他特性: | SMT RECEPTACLE |
联系完成配合: | GOLD (30) OVER NICKEL (100) | 联系完成终止: | Tin/Lead (Sn/Pb) |
触点材料: | NOT SPECIFIED | 设备插槽类型: | IC SOCKET |
使用的设备类型: | PGA209 | 外壳材料: | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER |
JESD-609代码: | e0 | 触点数: | 209 |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
5-1393211-0 | TE |
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Meets requirements of UL Class F construction |
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5-1393211-3 | TE |
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Meets requirements of UL Class F construction |
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5-1393211-4 | TE |
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Meets requirements of UL Class F construction |
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5-1393211-7 | TE |
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Meets requirements of UL Class F construction |
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513-93-223-18-098085 | MILL-MAX |
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IC Socket, PGA223, 223 Contact(s), |
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5-1393224-1 | MACOM |
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Miniature Power PCB RYII & RYII Reflow Solderable |
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5-1393224-2 | MACOM |
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Miniature Power PCB RYII & RYII Reflow Solderable |
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5-1393224-5 | MACOM |
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Miniature Power PCB RYII & RYII Reflow Solderable |
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5-1393224-8 | MACOM |
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Miniature Power PCB RYII & RYII Reflow Solderable |
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5-1393224-9 | MACOM |
获取价格 |
Miniature Power PCB RYII & RYII Reflow Solderable |
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