3B-XESR&3F-XESR&3H-XESR Series
ELECTRICAL SPECIFICATIONS
Specifications typical at +25°C, nominal input voltage, rated output current unless otherwise specifie
General Specifications:
Efficiency
64% to 70%
Switching frequency
125KHz, typ. 100%load
Environmental Specifications:
Operating temperature (ambient)
-25°C~ +71°C
-40°C~ +125
+90°C, max.
Storage temperature
Case temperature
Derating
None required
Up to 90%
Humidity (non-condensing)
Cooling
Free-air Convection
Physical Specifications:
Dimensions
31.80x8.60x13.47mm
1.25x0.34x0.53inches
10.7g
Weight
Case material
Non-conductive black
plastic
OUTLINE DIMENSIONS & PIN CONNECTIONS
Pin
1000, 3000 & 6000VDC
Single
+V Input
N.C.
1
2
3
N.C.
9
N.C.
10
11
12
-V output
+V output
-V input
RoHS COMPLIANT INFORMATION
This series is compatible with RoHS soldering systems with a peak wave solder temperature
of 300°C for 10 seconds.
The pin termination finish on the SIP package type is Tin Plate, Hot Dipped over Matte Tin
with Nickel Preplate. The DIP types are Matte Tin over Nickel Preplate. Both types in this
series are backward compatible with Sn/Pb soldering systems.
Microdc Professional Power Module,Inc.
Tel:0086-20-86000646 E-mail:tech@microdc.cn
Website:http://www.microdc.cn
REACH COMPLIANT INFORMATION
This series has proven that this product does not contain harmful chemicals, it also has
harmful chemical substances through the registration, inspection and approval.
http://www.microdc.cn Technical Enquiries-Email:tech@microdc.cn Tel:0086-20-86000646
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