Datasheet > 38-GX2F12.5-32.768

38-GX2F12.5-32.768

更新时间： 2022-09-18 17:38:47

品牌	Logo	应用领域
ILSI		/
页数	文件大小	规格书
2页	47K
描述
2 Lead Metal Package Crystal, 3 mm x 8 mm, 2 mm x 6 mm, 1 mm x 5 mm

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38-GX2F12.5-32.768 数据手册

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2 Lead Metal Package Crystal, 3 mm x 8 mm, 2 mm x 6 mm, 1 mm x 5 mm

38 / 26 / 15 Series

Pb Free Solder Reflow Profile:

Typical Circuit:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = 2a

Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).

Environmental Specifications

Thermal Shock

Moisture Resistance

Mechanical Shock

Mechanical Vibration

Resistance to Soldering

Heat

MIL-STD-883, Method 1011, Condition A

MIL-STD-883, Method 1004

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 2007, Condition A

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Hazardous Substance

Solderability

Terminal Strength

Gross Leak

Fine Leak

Solvent Resistance

Pb-Free / RoHS / Green Compliant

JESD22-B102-D Method 2 (Preconditioning E)

MIL-STD-883, Method 2004, Test Condition D

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

MIL-STD-202, Method 215

Marking

N/A –Packaging only

ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com

06/09

Specifications subject to change without notice

Page 2

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