ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device. These parameters are not production tested.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
V
Normal Operation (Steady-state)
Transient Over-voltage(1)
VPWR(SS)
VPWR(T)
-0.3 to 28
-0.3 to 40
Logic Input Voltage(2)
SF Output(3)
V
-0.3 to 7.0
-0.3 to 7.0
5.0
V
V
A
V
IN
V
SF
Continuous Output Current(4)
I
OUT(CONT)
ESD Voltage(5)
Human Body Model
Machine Model
V
V
±2000
±200
ESD1
ESD2
Charge Device Model
Corner Pins (1,22,23,44)
All Other Pins
±750
±500
THERMAL RATINGS
Storage Temperature
T
- 65 to 150
°C
°C
STG
Operating Temperature(6)
Ambient
T
-40 to 125
-40 to 150
A
Junction
T
J
Peak Package Reflow Temperature During Reflow(7),(8)
Approximate Junction-to-Case Thermal Resistance(9)
Notes
°C
TPPRT
Note 8
R
<1.0
°C/W
θJC
1. Device will survive repetitive transient over-voltage conditions for durations not to exceed 500 ms @ duty cycle not to exceed 10%.
External protection is required to prevent device damage in case of a reverse battery condition.
2. Exceeding the maximum input voltage on IN1, IN2, EN/D2 or D1 may cause a malfunction or permanent damage to the device.
3. Exceeding the pull-up resistor voltage on the open drain SF pin may cause permanent damage to the device.
4. Continuous output current capability is dependent on sufficient package heatsinking to keep junction temperature ≤150°C.
5. ESD testing is performed in accordance with the Human Body Model (C
= 100 pF, R
= 1500 Ω), Machine Model (C
= 200 pF,
ZAP
ZAP
ZAP
R
= 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).
ZAP
6. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
non-repetitive excursions of junction temperature above 150°C can be tolerated, provided the duration does not exceed 30 seconds
maximum. (Non-repetitive events are defined as not occurring more than once in 24 hours.)
7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
9. Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual RθJB (junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness and area. Maximum current at maximum
die temperature represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the RθJA must be
<5.0°C/W for maximum current at 70°C ambient. Module thermal design must be planned accordingly.
33931
Analog Integrated Circuit Device Data
Freescale Semiconductor
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