Datasheet > 33899_10

33899_10

更新时间： 2022-09-18 16:09:44

品牌	Logo	应用领域
飞思卡尔 - FREESCALE		/
页数	文件大小	规格书
26页	402K
描述
Programmable H-Bridge

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33899_10 数据手册

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

-0.3 to 40

-0.3 to 7.0

-0.3 to 5.0

-0.3 to 7.0

Protected Power Supply Voltage

Logic Supply Voltage

IGNP

Logic Output Bias Voltage

VCCL Supply Voltage

DDQ

CCL

Input/Output Voltage (FWD, REV, EN1, EN2, PWM, CS, DI, SCLK, DO, CSNS,

LSCMP, RS, REDIS)

I/O

, V

-0.5 to 40

-0.3 to 50

Motor Outputs

S0 S1

Charge Pump Voltage

CRES

ESD Voltage⁽¹⁾

±1500

±200

ESD1

ESD2

Human Body Model

Machine Model

THERMAL RATINGS

Operating Temperature⁽²⁾

Ambient

°C

-40 to 125

-40 to 150

Junction

-65 to 150

°C

Storage Temperature

STG

Thermal Resistance, Junction to Ambient⁽³⁾

Thermal Resistance, Junction to Case (Exposed Pad)

θJA

°C/W

<0.5

220

°C/W

°C

Peak Package Reflow Temperature During Solder Mounting⁽⁴⁾

SOLDER

Notes

1. ESD1 testing is performed in accordance with the Human Body Model (C

= 100 pF, R

= 1500 Ω), ESD2 testing is performed in

ZAP

accordance with the Machine Model (C

= 200 pF, R

= 0 Ω).

ZAP

2. The junction temperature is the primary limiting parameter. The module thermal design must provide a low enough thermal impedance

to keep the junction temperature within limits for all anticipated power levels and ambient temperatures.

R _JAis referenced to the JEDEC standard 2s2p thermal evaluation board at 1W total device power dissipation in still air. Deviations from

this standard will produce corresponding changes in the actual thermal performance.

4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

33899

Analog Integrated Circuit Device Data

Freescale Semiconductor

1 2 3 456 7 8...26

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