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33880_08 PDF预览

33880_08

更新时间: 2022-12-18 11:41:31
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 开关
页数 文件大小 规格书
25页 790K
描述
Configurable Octal Serial Switch with Serial Peripheral Interface I/O

33880_08 数据手册

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ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
Table 3. Maximum Ratings  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
VDD Supply Voltage (1)  
VDD  
-0.3 to 7.0  
VDC  
CS, DI, DO, SCLK, IN5, IN6, and EN (1)  
VPWR Supply Voltage (1)  
VPWR  
-0.3 to 7.0  
-16 to 50  
VDC  
VDC  
VDC  
Drain 1–8 (2)  
-18 to 40  
5.0 mA IOUT 0.3 A  
Source 1–8 (3)  
VDC  
-28 to 40  
5.0 mA IOUT 0.3 A  
Output Voltage Clamp Low-Side Drive (4)  
Output Voltage Clamp High-Side Drive (4)  
Output Clamp Energy (5)  
VOC  
VOC  
40 to 55  
-15 to -25  
50  
VDC  
VDC  
mJ  
V
ECLAMP  
ESD Voltage (6)  
Human Body Model  
Machine Model  
VESD1  
VESD2  
±2000  
±200  
Storage Temperature  
TSTG  
TC  
TJ  
-55 to 150  
-40 to 125  
-40 to 150  
-40 to 150  
°C  
°C  
°C  
°C  
W
Operating Case Temperature  
Operating Junction Temperature  
Maximum Junction Temperature  
Power Dissipation (TA = 25°C) (7)  
PD  
1.3  
1.7  
28 SOIC, Case 751F-05  
32 SOIC, Case 1324-02  
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05  
RθJA  
94  
°C/W  
°C/W  
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02  
RθJA  
RθJL  
70  
18  
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02  
(6)  
Peak Package Reflow Temperature During Reflow (5)  
,
TPPRT  
Note 6  
°C  
Notes  
1. Exceeding these limits may cause malfunction or permanent damage to the device.  
2. Configured as low-side driver with 300 mA load as current limit.  
3. Configured as high-side driver with 300 mA load as current limit.  
4. With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.  
5. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.  
6. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), and ESD2 testing is performed  
in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).  
7. Maximum power dissipation with no heatsink used.  
33880  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
5

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