Datasheet > 3.0SMC24A

3.0SMC24A

更新时间： 2024-02-10 22:36:31

品牌	Logo	应用领域
力特 - LITTELFUSE		/
页数	文件大小	规格书
5页	899K
描述
The 3.0SMC series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events

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3.0SMC24A 数据手册

TransientVoltage Suppression Diodes

Surface Mount > 3.0SMC series

Soldering Parameters

™

TVS Diode Arrays (SPA Family of Products)

Lead–free

Reﬂow Condition

assembly

t_p

T_P

-Temperature Min (T_s(min)

)

150°C

Ramp-up

Critical Zone

to T

T_L

Pre Heat -Temperature Max (T_s(max)

)

200°C

t_L

T_s(max)

-Time (min to max) (t_s)

60 – 180 secs

Average ramp up rate (LiquidusTemp (T_A)

to peak

Ramp-down

T_s(min)

3°C/second max

t_s

Preheat

T_S(max)toT_A- Ramp-up Rate

3°C/second max

217°C

-Temperature (T_A) (Liquidus)

Reﬂow

25˚C

t 25˚C to Peak

Time (t)

-Time (min to max) (t_s)

60 – 150 seconds

260^+0/-5°C

PeakTemperature (T_P)

Time within 5°C of actual peak

Temperature (t_p)

20 – 40 seconds

Ramp-down Rate

6°C/second max

8 minutes Max.

260°C

Environmental Speciﬁcations

Time 25°C to peakTemperature (T_P)

Do not exceed

HighTemp. Storage

JESD22-A103

JESD22-A108

JESD22-A104

Physical Speciﬁcations

HTRB

Weight

Case

0.007 ounce, 0.21 grams

Temperature Cycling

JEDEC DO214AB. Molded plastic body

over glass passivated junction

MSL

JEDEC-J-STD-020, Level 1

JESD22-A101

Color band denotes positive end

(cathode) except Bidirectional.

Polarity

H3TRB

RSH

MatteTin-plated leads, Solderable per

JESD22-B102

Terminal

JESD22-A111

Dimensions

DO-214AB (SMC J-Bend)

Inches

Millimeters

Dimensions

Cathode Band

Min

Max

Min

2.900

6.600

5.590

2.060

0.760

Max

3.200

0.114

0.260

0.220

0.079

0.030

0.126

0.280

0.245

0.103

0.060

0.008

0.320

0.012

7. 110

6.220

2.620

1.520

0.203

8.130

0.305

0.006

0.129

0.094

7.750

0.152

3.300

2.400

0.165

4.200

0.094

2.400

Speciﬁcations are subject to change without notice.

Revised: 11/20/15

1 2 345

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