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2T36L30MDBVREPG4 PDF预览

2T36L30MDBVREPG4

更新时间： 2024-01-30 01:57:25
品牌 Logo 应用领域
德州仪器 - TI 电源电路电源管理电路光电二极管监控
页数 文件大小 规格书
15页 400K
描述
NANOPOWER SUPERVISORY CIRCUITS

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中文翻译

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2T36L30MDBVREPG4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SOT-23
包装说明：LSSOP, TSOP5/6,.11,37针数：5
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.82
其他特性：RESET THRESHOLD VOLTAGE IS 2.64V可调阈值：NO
模拟集成电路 - 其他类型：POWER SUPPLY SUPPORT CIRCUITJESD-30 代码：R-PDSO-G5
JESD-609代码：e4长度：2.9 mm
湿度敏感等级：1信道数量：1
功能数量：1端子数量：5
最高工作温度：125 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装代码：LSSOP
封装等效代码：TSOP5/6,.11,37封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, LOW PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：260
电源：1.8/5 V认证状态：Not Qualified
座面最大高度：1.45 mm子类别：Power Management Circuits
最大供电电流 (Isup)：0.03 mA最大供电电压 (Vsup)：6 V
最小供电电压 (Vsup)：1.6 V标称供电电压 (Vsup)：2 V
表面贴装：YES温度等级：MILITARY
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.95 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：1.6 mm
Base Number Matches：1

2T36L30MDBVREPG4 数据手册

 浏览型号2T36L30MDBVREPG4的Datasheet PDF文件第7页浏览型号2T36L30MDBVREPG4的Datasheet PDF文件第8页浏览型号2T36L30MDBVREPG4的Datasheet PDF文件第9页浏览型号2T36L30MDBVREPG4的Datasheet PDF文件第11页浏览型号2T36L30MDBVREPG4的Datasheet PDF文件第12页浏览型号2T36L30MDBVREPG4的Datasheet PDF文件第13页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
8-Dec-2008  
PACKAGING INFORMATION  
Orderable Device  
2T36L30MDBVREPG4  
TPS3836J25MDBVTEP  
TPS3836L30MDBVREP  
TPS3837K33MDBVREP  
TPS3837K33QDBVREP  
V62/06637-09XE  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06637-15XE  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06637-17XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06637-22XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TPS3836J25-EP, TPS3836L30-EP, TPS3837K33-EP :  
Catalog: TPS3836J25, TPS3836L30, TPS3837K33  
•
Addendum-Page 1  
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中文翻译

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