Not for New Designs. See Vishay 298D Series for New Design and/or Replacements
292D
Solid Tantalum Chip Capacitors,
TANTAMOUNT Leadframeless Molded
Vishay Sprague
®
6.
Printed Circuit Board Materials: Molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
GUIDE TO APPLICATION
1.
A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
P
7.
Attachment:
I
=
---------------
rms
R
ESR
7.1
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" 0.001"
[0.178 mm 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
where,
P =
Power Dissipation in Watts at + 25 °C as
given in the table in Paragraph Number 5
(Power Dissipation).
The capacitor Equivalent Series
Resistance at the specified frequency.
RESR
=
2.
A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
P
7.2
Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
V
= Z ---------------
rms
R
ESR
or, from the formula:
= I
V
× Z
rms
rms
where,
P =
Power Dissipation in Watts at + 25 °C as
given in the table in Paragraph Number 5
(Power Dissipation).
The capacitor Equivalent Series
Resistance at the specified frequency.
The capacitor impedance at the specified
frequency.
RESR
Z =
=
7.2.1 Backward and Forward Compatibility: Capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
2.1
2.2
3.
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
8.
Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C, 5 % of the DC
rating at + 85 °C and 1 % of the DC rating at + 125 °C.
8.1
9.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l at 40 kHz for
2 minutes.
4.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
TEMPERATURE
+ 25 °C
DERATING FACTOR
Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to
minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and/or
circuit board design.
1.0
0.9
0.4
+ 85 °C
+ 125 °C
5.
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25 °C temperature
rise.)
Document Number: 40042
Revision: 16-Sep-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
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