Contents
7.1.3 Lock-Down.............................................................................................................40
7.1.4 Block Lock Status ..................................................................................................41
7.1.5 Lock During Erase Suspend.................................................................................. 41
7.1.6 Status Register Error Checking .............................................................................41
7.1.7 WP# Lock-Down Control .......................................................................................42
Protection Register ............................................................................................................. 42
7.2.1 Reading the Protection Register............................................................................43
7.2.2 Programing the Protection Register....................................................................... 43
7.2.3 Locking the Protection Register.............................................................................44
VPP Protection ................................................................................................................... 45
7.2
7.3
8.0 Set Configuration Register................................................................................................ 46
8.1
8.2
Read Mode (CR[15])........................................................................................................... 48
First Access Latency Count (CR[13:11]) ............................................................................48
8.2.1 Latency Count Settings.......................................................................................... 49
WAIT Signal Polarity (CR[10]) ............................................................................................ 50
WAIT Signal Function......................................................................................................... 50
Data Hold (CR[9]) ............................................................................................................... 51
WAIT Delay (CR[8])............................................................................................................52
Burst Sequence (CR[7])...................................................................................................... 52
Clock Edge (CR[6]).............................................................................................................54
Burst Wrap (CR[3]) .............................................................................................................54
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10 Burst Length (CR[2:0])........................................................................................................ 54
9.0 Power Consumption.............................................................................................................55
9.1
9.2
9.3
9.4
Active Power.......................................................................................................................55
Automatic Power Savings (APS) ........................................................................................55
Standby Power ................................................................................................................... 55
Power-Up/Down Characteristics......................................................................................... 55
9.4.1 System Reset and RST# .......................................................................................56
9.4.2 VCC, VPP, and RST# Transitions ......................................................................... 56
Power Supply Decoupling................................................................................................... 56
9.5
10.0 Thermal and DC Characteristics..................................................................................... 57
10.1 Absolute Maximum Ratings................................................................................................ 57
10.2 Operating Conditions.......................................................................................................... 57
10.3 DC Current Characteristics (.13 µ and .18 µµ).................................................................58
10.4 DC Voltage Characteristics................................................................................................. 60
11.0 AC Characteristics................................................................................................................ 62
11.1 Read Operations – .13 µµ Λιτηογραπηψ ............................................................................62
11.2 Read Operations – .18 µµ Λιτηογραπηψ ............................................................................64
11.3 AC Write Characteristics.....................................................................................................74
11.4 Erase and Program Times..................................................................................................79
11.5 Reset Specifications ........................................................................................................... 80
11.6 AC I/O Test Conditions....................................................................................................... 81
11.7 Device Capacitance............................................................................................................82
Appendix A Write State Machine States...............................................................................83
Appendix B Common Flash Interface....................................................................................86
4
Datasheet
5秒后页面跳转
TLP250光耦合器：资料手册参数分析
DA14580 低功耗蓝牙系统级芯片(SoC)：资料手册参数分析
INA226 高精度电流和功率监控器：资料手册参数分析
SI2302 N沟道MOSFET：资料手册参数分析
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
