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251R15S121JG3Z PDF预览

251R15S121JG3Z

更新时间： 2024-01-15 06:23:24
品牌 Logo 应用领域
约翰逊 - JOHANSON 电容器
页数 文件大小 规格书
11页 885K
描述
CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT

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251R15S121JG3Z 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Contact Manufacturer包装说明：, 0805
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.24.00.20风险等级：5.37
电容：0.00012 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMICJESD-609代码：e4
安装特点：SURFACE MOUNT多层：Yes
负容差：5%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE包装方法：TR, EMBOSSED, 5 INCH
正容差：5%额定（直流）电压（URdc）：250 V
尺寸代码：0805表面贴装：YES
温度特性代码：C0G温度系数：30ppm/Cel ppm/ °C
端子面层：Gold (Au) - with Nickel (Ni) barrier端子形状：WRAPAROUND
Base Number Matches：1

251R15S121JG3Z 数据手册

 浏览型号251R15S121JG3Z的Datasheet PDF文件第1页浏览型号251R15S121JG3Z的Datasheet PDF文件第2页浏览型号251R15S121JG3Z的Datasheet PDF文件第3页浏览型号251R15S121JG3Z的Datasheet PDF文件第5页浏览型号251R15S121JG3Z的Datasheet PDF文件第6页浏览型号251R15S121JG3Z的Datasheet PDF文件第7页 
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TEMPERATURE COEFFICIENT:  
QUALITꢀ FACTOR / DF:  
0
30ppm /°C, -55 to 125°C  
15%, -55 to 125°C  
Q
>1,000 @ 1 MHz, Typical 10,000  
16VDC DF≤ 3.5% @ 1 KHz, 25°C  
10VDC DF≤ 5.0% @ 1 KHz, 25°C  
INSULATION RESISTANCE:  
>10 GΩ @ 25°C,WVDC;  
125°C IR is 10% of 25°C rating  
>500 ΩF* or 10 GΩ* @ 25°C,WVDC;  
125°C IR is 10% of 25°C rating  
* whichever is less  
DIELECTRIC STRENGTH:  
TEST PARAMETERS:  
2.5 X WVDC Min., 25°C, 50 mA max  
1MHz 50kHz, 1.0 0.2 VRMS, 25°C  
Size 01005: 0.2 - 10 pF  
2.5 X WVDC Min., 25°C, 50 mA max  
1KHz 50Hz, 1.0 0.2 VRMS, 25°C  
100 - 10,000 pF  
AVAILABLE CAPACITANCE:  
Size 0201: 0.2 - 100 pF  
Size 0402: 0.2 - 33 pF  
Size 0603: 0.2 - 100 pF  
Size 0805: 0.3 - 220 pF  
Size 1111: 0.2 - 1000 pF  
Size 2525: 1.0 - 2700 pF  
Size 3838: 1.0 - 5100 pF  
meCHaniCal & environmenTal  
CHaraCTerisTiCs  
SPECIFICATION  
TEST PARAMETERS  
SOLDERABILITꢀ:  
Solder coverage ≥ 90% of metalized areas  
No termination degradation  
Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux  
then dip in Sn62 solder @ 240° 5°C for 5 1 sec  
RESISTANCE TO  
SOLDERING HEAT:  
No mechanical damage  
Capacitance change: 2.5% or 0.25pF  
Q>500 I.R. >10 G Ohms  
Preheat device to 80°-100°C for 60 sec.  
followed by 150°-180°C for 60 sec.  
Dip in 260° 5°C solder for 10 1 sec.  
Measure after 24 2 hour cooling period  
Breakdown voltage: 2.5 x WVDC  
TERMINAL  
ADHESION:  
Termination should not pull off.  
Ceramic should remain undamaged.  
Linear pull force* exerted on axial leads soldered to each terminal.  
*0402 ≥ 2.0lbs, 0603 ≥ 2.0lbs (min.)  
PCB DEFLECTION:  
No mechanical damage.  
Capacitance change: 2% or 0.5pF Max  
Glass epoxy PCB: 0.5 mm deflection  
LIFE TEST:  
No mechanical damage  
Capacitance change: 3.0% or 0.3 pF  
Q>500 I.R. >1 G Ohms  
Applied voltage: 200% rated voltage, 50 mA max.  
Temperature: 125° 3°C  
Test time: 1000+48-0 hours  
Breakdown voltage: 2.5 x WVDC  
THERMAL CꢀCLE:  
No mechanical damage.  
Capacitance change: 2.5% or 0.25pF  
Q>2000 I.R. >10 G Ohms  
5 cycles of: 30 3 minutes @ -55°+0/-3°C,  
2-3 min. @ 25°C, 30 3 min. @ +125°+3/-0°C,  
2-3 min. @ 25°C  
Breakdown voltage: 2.5 x WVDC  
Measure after 24 2 hour cooling period  
HUMIDITꢀ,  
STEADꢀ STATE:  
No mechanical damage.  
Relative humidity: 90-95%  
Temperature: 40° 2°C  
Test time: 500 +12/-0 Hours  
Measure after 24 2 hour cooling period  
Capacitance change: 5.0% or 0.50pF max.  
Q>300 I.R. ≥ 1 G-Ohm  
Breakdown voltage: 2.5 x WVDC  
HUMIDITꢀ,  
LOW VOLTAGE:  
No mechanical damage.  
Capacitance change: 5.0% or 0.50pF max.  
Q>300 I.R. = 1 G-Ohm min.  
Applied voltage: 1.5 VDC, 50 mA max.  
Relative humidity: 85 2% Temperature: 40° 2°C  
Test time: 240 +12/-0 Hours  
Breakdown voltage: 2.5 x WVDC  
Measure after 24 2 hour cooling period  
VIBRATION:  
No mechanical damage.  
Capacitance change: 2.5% or 0.25pF  
Q>1000 I.R. ≥ 10 G-Ohm  
Breakdown voltage: 2.5 x WVDC  
Cycle performed for 2 hours in each of three perpendicular directions  
Frequency range 10Hz to 55 Hz to 10 Hz traversed  
in 1 minute. Harmonic motion amplitude: 1.5mm  
10  
www.johansontechnology.com  
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与251R15S121JG3Z相关器件

型号 品牌 获取价格 描述 数据表
251R15S121JG4Z JOHANSON

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 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP, ROHS CO
251R15S121JT3Z JOHANSON

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 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP
251R15S121JT4Z JOHANSON

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 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP
251R15S121JV3Z JOHANSON

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 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP, ROHS CO
251R15S121JV4Z JOHANSON

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 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP, ROHS CO
251R15S121JV6Z JOHANSON

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 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP, ROHS CO
251R15S121KG3Z JOHANSON

获取价格

 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP, ROHS CO
251R15S121KG4Z JOHANSON

获取价格

 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP, ROHS CO
251R15S121KG6Z JOHANSON

获取价格

 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP, ROHS CO
251R15S121KT3Z JOHANSON

获取价格

 		CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.00012 uF, SURFACE MOUNT, 0805, CHIP

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