Phycomp
Product specification
Surface-mount ceramic
multilayer capacitors
Low-inductance: Class 2, X7R
10/16/25/50 V
TESTS AND REQUIREMENTS
Table 3 Test procedures and requirements
IEC
IEC
60384-10/
CECC 32 100
CLAUSE
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4
mounting
the capacitors may be
mounted on printed-
no visible damage
circuit boards or ceramic
substrates by applying
wave soldering, reflow
soldering (including
vapour phase soldering)
or conductive adhesive
4.5
visual inspection and any applicable method
in accordance with specification
dimension check
using ×10 magnification
4.6.1
4.6.2
capacitance
f = 1 kHz; measuring
voltage 1 Vrms at 20 °C
measured 1000 hours after date
of manufacture
D.F.
f = 1 kHz; measuring
in accordance with specification
voltage 1 Vrms at 20 °C
at Ur (DC) for 1 minute
4.6.3
4.6.4
4.7.1
insulation resistance
voltage proof
in accordance with specification
no breakdown or flashover
2.5 × Ur for 1 minute
temperature
characteristic
between minimum and
maximum temperature
in accordance with specification
4.8
adhesion
a force of 5 N applied for
10 s to the line joining the
terminations and in a
plane parallel to the
substrate
no visible damage
4.9
bond strength of
plating on end face
mounted in accordance
with CECC 32 100,
paragraph 4.4
no visible damage
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig 340 mm
l∆C/Cl: ±10% l
4.10
Tb
resistance to
soldering heat
precondition:
120 to 150 °C
the terminations shall be well
tinned after recovery
for 1 minute
260 ±5 °C for 10 ±0.5 s
in a static solder bath
resistance to
leaching
260 ±5 °C for 30 ±1 s
in a static solder bath
using visual enlargement of ×10,
dissolution of the terminations
shall not exceed 10%
2004 May 14 Rev.8
7
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