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225506015649 PDF预览

225506015649

更新时间: 2023-05-15 00:00:00
品牌 Logo 应用领域
国巨 - YAGEO /
页数 文件大小 规格书
9页 177K
描述
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 1206, CHIP

225506015649 数据手册

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Phycomp  
Product specification  
Surface-mount ceramic  
multilayer capacitors  
Low-inductance: Class 2, X7R  
10/16/25/50 V  
TESTS AND REQUIREMENTS  
Table 3 Test procedures and requirements  
IEC  
IEC  
60384-10/  
CECC 32 100  
CLAUSE  
60068-2  
TEST  
METHOD  
TEST  
PROCEDURE  
REQUIREMENTS  
4.4  
mounting  
the capacitors may be  
mounted on printed-  
no visible damage  
circuit boards or ceramic  
substrates by applying  
wave soldering, reflow  
soldering (including  
vapour phase soldering)  
or conductive adhesive  
4.5  
visual inspection and any applicable method  
in accordance with specification  
dimension check  
using ×10 magnification  
4.6.1  
4.6.2  
capacitance  
f = 1 kHz; measuring  
voltage 1 Vrms at 20 °C  
measured 1000 hours after date  
of manufacture  
D.F.  
f = 1 kHz; measuring  
in accordance with specification  
voltage 1 Vrms at 20 °C  
at Ur (DC) for 1 minute  
4.6.3  
4.6.4  
4.7.1  
insulation resistance  
voltage proof  
in accordance with specification  
no breakdown or flashover  
2.5 × Ur for 1 minute  
temperature  
characteristic  
between minimum and  
maximum temperature  
in accordance with specification  
4.8  
adhesion  
a force of 5 N applied for  
10 s to the line joining the  
terminations and in a  
plane parallel to the  
substrate  
no visible damage  
4.9  
bond strength of  
plating on end face  
mounted in accordance  
with CECC 32 100,  
paragraph 4.4  
no visible damage  
conditions: bending  
1 mm at a rate of 1 mm/s,  
radius jig 340 mm  
lC/Cl: ±10% l  
4.10  
Tb  
resistance to  
soldering heat  
precondition:  
120 to 150 °C  
the terminations shall be well  
tinned after recovery  
for 1 minute  
260 ±5 °C for 10 ±0.5 s  
in a static solder bath  
resistance to  
leaching  
260 ±5 °C for 30 ±1 s  
in a static solder bath  
using visual enlargement of ×10,  
dissolution of the terminations  
shall not exceed 10%  
2004 May 14 Rev.8  
7
www.yageo.com  

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