Datasheet > 2101C0M300000FBS

2101C0M300000FBS

更新时间： 2023-05-15 00:00:00

品牌	Logo	应用领域
美高森美 - MICROSEMI		/
页数	文件大小	规格书
26页	1219K
描述
CMOS Output Clock Oscillator,

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2101C0M300000FBS 数据手册

SCOPE

1.1

General. This specification defines the design, assembly and functional evaluation of high

reliability, hybrid TCXOs produced by Vectron International. Devices delivered to this

specification represent the standardized Parts, Materials and Processes (PMP) Program

developed, implemented and certified for advanced applications and extended environments.

1.2

Applications Overview. The designs represented by these products were primarily developed

for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options

imbedded within DOC200103 bridge the gap between Space and COTS hardware by providing

custom hardware with measures of mechanical, assembly and reliability assurance needed for

Military, Ruggedized COTS or Commercial environments.

APPLICABLE DOCUMENTS

2.1

Specifications and Standards. The following specifications and standards form a part of this

document to the extent specified herein. The issue currently in effect on the date of quotation

will be the product baseline, unless otherwise specified. In the event of conflict between the

texts of any references cited herein, the text of this document shall take precedence.

Military

MIL-PRF-55310

MIL-PRF-38534

Oscillators, Crystal Controlled, General Specification For

Hybrid Microcircuits, General Specification For

Standards

MIL-STD-202

MIL-STD-883

Test Method Standard, Electronic and Electrical Component Parts

Test Methods and Procedures for Microelectronics

Vectron International

QSP-90100

DOC007131

Quality Systems Manual, Vectron International

Identification Common Documents, Materials and Processes, Hi-Rel XO

DPA Specification

DOC203982

QSP-91502

Procedure for Electrostatic Discharge Precautions

GENERAL REQUIREMENTS

3.1

Classification. All devices delivered to this specification are of hybrid technology conforming

to Type 3, Class 2 of MIL-PRF-55310. Devices carry a Class 1C ESDS classification per

MIL-PRF-38534 and are marked with a single equilateral triangle at pin 1 per MIL-PRF-

55310.

3.2

Item Identification. External packaging choices are either metal flatpacks or DDIP with either

Sinewave or CMOS logic output. Unique Model Number Series’ are utilized to identify device

package configurations and output waveform as listed in Table 1.

CODE IDENT NO.

UNSPECIFIED TOLERANCES

SIZE

DWG NO.

REV.

SHEET

00136

N/A

DOC200103

123 4 5 6 7...26

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