1N5913BP thru 1N5956BP (Plastic)
Axial-Leaded 1.5 Watt Zener Diodes
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
The 1N5913-5956B series of 1.5 watt Zeners provides voltage regulation in a
selection from 3.3 to 200 volts with different tolerances as identified by suffix
letter on the part. These plastic encapsulated Zeners have moisture
classification of Level 1 with no dry pack required. They are also available in
various military screening levels by adding a prefix identifier as described in
the Features below. The plastic molded Zeners with a P suffix provide a
lower thermal resistance (junction to lead) compared to the optional glass
body (G suffix) for these same JEDEC part numbers. Both package options
are available by Microsemi. Microsemi also offers numerous other Zener
products to meet higher or lower power and test-current applications.
DO-41 or
DO-204AL
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
•
•
JEDEC registered 1N5913 to 1N5956B
Zener voltage available 3.3V to 200V
•
Regulates voltage over a broad operating current
and temperature range
•
•
•
•
Wide selection from 3.3 to 200 V
Flexible axial-lead mounting terminals
Nonsensitive to ESD
Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
•
•
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
Moisture classification is Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
•
Specified capacitance (see Figure 3)
•
•
Surface mount equivalents available as SMBJ5913 to
SMBJ5956B or SMBG5913 to SMBG5956B
Optional glass body axial-leaded Zeners available as
1N5913BG to 1N5956BG (see separate data sheet)
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
Power dissipation at 25ºC: 1.5 watts (also see
derating in Figure 1).
•
•
•
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
•
•
Operating and Storage temperature: -65ºC to +150ºC
TERMINALS: Leads, tin-lead plated solderable per
MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
Thermal Resistance: 45 ºC/W junction to lead at 3/8
(10 mm) lead length from body, or 105ºC/W junction
to ambient when mounted on FR4 PC board (1 oz
Cu) with 4 mm2 copper pads and track width 1 mm,
length 25 mm
•
•
MARKING: Part number
•
Steady-State Power: 1.5 watts at TL < 82.5oC 3/8
inch (10 mm) from body, or 1.19 watts at TA = 25ºC
when mounted on FR4 PC board as described for
thermal resistance (also see Figure 1)
TAPE & REEL optional: Standard per EIA-296
(add “TR” suffix to part number)
•
•
WEIGHT: 0.7 grams
See package dimensions on last page
•
•
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260 ºC for 10 s (max)
Copyright 2003
Microsemi
Page 1
10-13-2003 REV B
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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