1N3611 thru 1N3614, 1N3957
VOIDLESS-HERMETICALLY-SEALED
STANDARD RECOVERY GLASS
RECTIFIERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This “standard recovery” rectifier diode series is military qualified to MIL-PRF-
19500/228 and is ideal for high-reliability applications where a failure cannot be
tolerated. These industry-recognized 1.0 Amp rated rectifiers for working peak
reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-glass
construction using an internal “Category I” metallurgical bond. These devices are
similar in ratings to the 1N5614 thru 1N5622 series where surface mount MELF
package configurations are available by adding a “US” suffix (see separate data
sheet for 1N5614US thru 1N5622US). Microsemi also offers numerous other
rectifier products to meet higher and lower current ratings with various recovery time
speed requirements including fast and ultrafast device types in both through-hole
and surface mount packages.
“A” Package
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
Popular JEDEC registered 1N3611 thru 1N3614 and
•
Standard recovery 1 Amp rectifiers 200 to 1000 V
1N3597 series
•
•
Military and other high-reliability applications
General rectifier applications including bridges, half-
bridges, catch diodes, etc.
•
•
•
•
•
Voidless hermetically sealed glass package
Triple-Layer Passivation
Internal “Category I” Metallurgical bonds
Working Peak Reverse Voltage 200 to 1000 Volts.
•
•
•
High forward surge current capability
Extremely robust construction
Low thermal resistance
JAN, JANTX, and JANTXV available per MIL-PRF-
•
Controlled avalanche with peak reverse power
19500/286 (for JANS, see 1N5614-5622 series)
capability
•
Surface mount equivalents also available in a square
end-cap MELF configuration with “US” suffix (also
see 1N5614US thru 1N5622US)
•
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
•
Junction & Storage Temperature: -65oC to +175oC
•
•
CASE: Hermetically sealed voidless hard glass
Thermal Resistance: 38oC/W junction to lead at 3/8
inch (10 mm) lead length from body
Average Rectified Forward Current (IO): 1.0 Amps @
TA = 100ºC and 0.30 Amps at 150ºC
Forward Surge Current: 30 Amps @ 8.3 ms half-sine
Solder Temperatures: 260ºC for 10 s (maximum)
with Tungsten slugs
TERMINATIONS: Axial leads are copper with
Tin/Lead (Sn/Pb) finish
MARKING: Body paint and part number, etc.
POLARITY: Cathode band
TAPE & REEL option: Standard per EIA-296
WEIGHT: 340 mg
See package dimensions on last page
•
•
•
•
•
•
•
•
ELECTRICAL CHARACTERISTICS
WORKING
MINIMUM
BREAKDOWN
VOLTAGE
AVERAGE
RECTIFIED
CURRENT
(NOTE 2)
MAXIMUM
FORWARD
VOLTAGE
MAXIMUM
SURGE
PEAK
MAXIMUM REVERSE
CURRENT
REVERSE
VOLTAGE
CURRENT
(NOTE1)
TYPE
V
@ 1 A
F
V
V
@ 100µA
I
I
@ V
I
(PULSED)
VOLTS
RWM
BR
O
R
RWM
FSM
VOLTS
VOLTS
AMPS
AMPS
µA
o
150oC
25oC
1.0
1.0
1.0
1.0
1.0
150oC
300
300
300
300
300
JAN1N3611
JAN1N3612
JAN1N3613
JAN1N3614
JAN1N3957
200
400
240
480
1100.0C
1.0
0.30
0.30
0.30
0.30
0.30
1.1
1.1
1.1
1.1
1.1
30
30
30
30
30
600
720
1.0
800
920
1.0
1000
1150
1.0
NOTE 1: TA = 25oC, IO = 1.0 A, 10 surges of 8.3 ms @ 1 minute intervals
NOTE 2: Linearly derate at 13.3 mA/ºC between TA=100ºC and 175ºC
Copyright 2004
12-08 2004 REV A
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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