Datasheet > 1812L7524

1812L7524

更新时间： 2022-02-26 11:19:51

品牌	Logo	应用领域
力特 - LITTELFUSE		/
页数	文件大小	规格书
7页	958K
描述
POLY-FUSE Resettable PTCs

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数据手册

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1812L7524 数据手册

POLY-FUSE Resettable PTCs

Surface Mount > 1812L Series

Temperature Rerating Curve

Physical Speciﬁcations

Solder-Plated Copper (Solder Material:

MatteTin (Sn))

Terminal Material

Lead Solderability

170%

150%

130%

Meets EIA Speciﬁcation RS186-9E, ANSI/

J-STD-002 Category 3.

110%

90%

70%

Environmental Speciﬁcations

Operating/StorageTemp.

-40°C to +85°C

Max. Device SurfaceTemp.

inTripped State

125°C

50%

30%

10%

+85°C, 1000 hours

-/+5% typical resistance change

Passive Aging

+85°C, 85% R.H.,1000 hours

-/+5% typical resistance change

-40 -30 -20 -10

20 30

Temperature (°C)

40 50 60 70 80 85

Humidity Aging

MIL–STD–202, Method 107G

+85°C/-40°C 20 times

Thermal Shock

-30% typical resistance change

MIL–STD–202, Method 215,

No change

Solvent Resistance

MIL–STD–883C, Method 2007.1,

Condition A, No change

Vibration

Moisture Level Sesitivity

Level 1, J–STD–020C

Soldering Parameters

Condition

Reﬂow

PeakTemp/ DurationTime

260°C / 10 Sec

Soldering

Cooling

260

220

Time above liquids (TAL) 220°C

Preheat 120°C~ 180°C

Storage Condition

60 Sec ~ 100 Sec

50 Sec ~ 150 Sec

0°C~35°C, 70%RH

Preheating

180

• Recommended reﬂow methods: IR, vapor phase oven, hot air

oven, N₂environment for lead–free

120

• Recommended maximum paste thickness is 0.25mm (0.010 inch)

• Devices can be cleaned using standard industry methods and

solvents.

60 to 100

120

50 to 150

Note: If reﬂow temperatures exceed the recommended proﬁle,

Time(s)

devices may not meet the performance requirements.

Speciﬁcations are subject to change without notice.

Revised: 11/05/13

1 234 5 6 7

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