Datasheet > 18-140-W

18-140-W

更新时间： 2024-01-12 12:02:20

品牌	Logo	应用领域
其他 - ETC		端子和端子排
页数	文件大小	规格书
282页	5761K
描述
High-Speed Interconnect Technology

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技术参数
数据手册

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18-140-W 技术参数

生命周期：	Obsolete	Reach Compliance Code：	unknown
ECCN代码：	EAR99	HTS代码：	8536.69.40.40
风险等级：	5.63	其他特性：	PHENOLIC, 94V-1
紧固方法：	SOLDER	层数：	1
行数：	2	通路数：	18
额定电流：	15 A	额定电压：	250 V
安全认证：	UL; CSA	端子和端子排类型：	BARRIER STRIP TERMINAL BLOCK
线规：	16 AWG	Base Number Matches：	1

18-140-W 数据手册

CIN::APSE

High-Speed Interconnect Technology

THE BUTTON CONTACT

The unique construction of the CIN::APSE contact

provides superior mechanical and electrical performance.

It is constructed of randomly wound molybdenum wire that

is formed into a cyclindrical shape. Standard CIN::APSE

contact diameters are 0.020" and 0.040".

Mechanical

• Small form factor (0.020" diameter by 0.32" min. high)

• Low compression force (approx. 2.5 oz. min. per contact)

• Multiple beam structures

• Several points of contact per button

• Extremely lightweight

Typical CIN::APSE Applications

• Natural wiping action

• LGA package I/O to PC board (IC packages,

multi-chip modules)

Electrical

• PC board to PC board (parallel processors,

enhancement/mezzanine cards)

• Flex circuit to PC board (rigid flex, harnessing)

• Short signal path

• Very low inductance and resistance

• Signal integrity tested in the GHz range

• Flex circuit to ceramic (chip to harness)

CIN::APSE APPLIED

The basic button contact

configuration consists of a single

button installed in our patented

“hourglass” design.

Step 2:

Add Z-Axis compression

and secure.

Step 1:

Using alignment features,

position the CIN::APSE

connector between a LGA chip

package and PCB or two PCBs

that have matching footprints.

The hourglass cavity retains the

CIN::APSE contact securely.

Typically 0.003" protrudes from the

top and the bottom of the insulator.

Call Toll Free: 1 (800) 323-9612

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