POLYFUSE® Resettable PTCs
Radial Leaded > 16R Series
Soldering Parameters -Wave Soldering
Refer to the condition
recommended by the
flux manufacturer.
Soldering
Cooling
260
220
Pre-Heating Zone
Max. ramping rate
should not exceed 4°C/
Sec.
Preheating
190
160
Max. solder
temperature should not
exceed 260°C
Soldering Zone
Cooling Zone
Cooling by natural
convection in air.
0
5 max.
60 min.
Time(s)
Environmental Specifications
Operating/Storage
Physical Specifications
2.5A:Tin-plated Copper clad Steel
3.0 - 14.0A:Tin-plated Copper
Lead Material
-40°C to +85°C
Temperature
Soldering
Characteristics
Solderability per MIL–STD–202,
Method 208E
Maximum Device Surface
Temperature inTripped State
125°C
+85°C, 1000 hours
-/+ 5% typical resistance
change
Cured, flame retardant epoxy polymer
meets UL94V-0 requirements.
Insulating Material
Device Labeling
Passive Aging
Humidity Aging
Thermal Shock
Marked with ‘LF’, voltage, current rating,
and date code.
+85°C, 85% R.H., 1000 hours
-/+ 5% typical resistance
change
+85°C to -40°C 10 times
-/+ 5% typical resistance
change
MIL–STD–202, Method 215F
No change
Solvent Resistance
Moisture Resistance Level
Level 1, J–STD–020C
71
Revised: July 12, 2010
© 2010 Littelfuse, Inc
16R Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/16R.html for current information.