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1339-31DVGI PDF预览

1339-31DVGI

更新时间: 2024-01-25 18:51:56
品牌 Logo 应用领域
艾迪悌 - IDT 计时器或实时时钟微控制器和处理器外围集成电路光电二极管PC
页数 文件大小 规格书
27页 362K
描述
REAL-TIME CLOCK WITH SERIAL I2C INTERFACE

1339-31DVGI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSSOP
包装说明:MSOP-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.4
Samacsys Confidence:3Samacsys Status:Released
2D Presentation:https://componentsearchengine.com/2D/0T/276930.2.1.pngSchematic Symbol:https://componentsearchengine.com/symbol.php?partID=276930
PCB Footprint:https://componentsearchengine.com/footprint.php?partID=2769303D View:https://componentsearchengine.com/viewer/3D.php?partID=276930
Samacsys PartID:276930Samacsys Image:https://componentsearchengine.com/Images/9/1339-31DVGI.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/2/1339-31DVGI.jpgSamacsys Pin Count:8
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Small Outline Packages
Samacsys Footprint Name:8-pin MSOP-1Samacsys Released Date:2020-02-07 05:31:33
Is Samacsys:N最大时钟频率:0.032 MHz
信息访问方法:I2C中断能力:Y
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
湿度敏感等级:3端子数量:8
计时器数量:1最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP8,.19
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:3.6/5 V
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:Timer or RTC最大供电电压:5.5 V
最小供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
最短时间:SECONDS处于峰值回流温度下的最长时间:30
易失性:YESuPs/uCs/外围集成电路类型:TIMER, REAL TIME CLOCK
Base Number Matches:1

1339-31DVGI 数据手册

 浏览型号1339-31DVGI的Datasheet PDF文件第1页浏览型号1339-31DVGI的Datasheet PDF文件第2页浏览型号1339-31DVGI的Datasheet PDF文件第4页浏览型号1339-31DVGI的Datasheet PDF文件第5页浏览型号1339-31DVGI的Datasheet PDF文件第6页浏览型号1339-31DVGI的Datasheet PDF文件第7页 
IDT1339  
REAL-TIME CLOCK WITH SERIAL I2C INTERFACE  
RTC  
Typical Operating Circuit  
CRYSTAL  
VCC  
VCC  
VCC  
1
2
8
RPU  
2k  
RPU  
2k  
VCC  
10k  
X1  
X2  
6
5
7
3
SCL  
SQW/INT  
CPU  
IDT1339  
VBACKUP  
SDA  
+
GND  
4
-
Detailed Description  
The following sections discuss in detail the Oscillator block,  
Power Control block, Clock/Calendar Register, Alarms,  
trickle Charger, and Serial I2C block.  
Oscillator Block  
Selection of the right crystal, correct load capacitance and  
careful PCB layout are important for a stable crystal  
oscillator. Due to the optimization for the lowest possible  
current in the design for these oscillators, losses caused by  
parasitic currents can have a significant impact on the  
overall oscillator performance. Extra care needs to be taken  
to maintain a certain quality and cleanliness of the PCB.  
Crystal Selection  
The key parameters when selecting a 32 kHz crystal to work  
with IDT1339 RTC are:  
In the above figure, X1 and X2 are the crystal pins of our  
device. Cin1 and Cin2 are the internal capacitors which  
include the X1 and X2 pin capacitance. Cex1 and Cex2 are  
the external capacitors that are needed to tune the crystal  
frequency. Ct1 and Ct2 are the PCB trace capacitances  
between the crystal and the device pins. CS is the shunt  
capacitance of the crystal (as specified in the crystal  
manufacturer's datasheet or measured using a network  
analyzer).  
Recommended Load Capacitance  
Crystal Effective Series Resistance (ESR)  
Frequency Tolerance  
Effective Load Capacitance  
Please see diagram below for effective load capacitance  
calculation. The effective load capacitance (CL) should  
match the recommended load capacitance of the crystal in  
order for the crystal to oscillate at its specified parallel  
resonant frequency with 0ppm frequency error.  
Note: IDT1339CSRI integrates a standard 32.768 kHz  
( 20ppm) crystal in the package and contributes an  
additional frequency error of 10ppm at nominal VCC (+3.3 V)  
and TA=+25°C.  
IDT® REAL-TIME CLOCK WITH SERIAL I2C INTERFACE  
3
IDT1339  
REV K 032910  

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