Datasheet > 1210L-025

1210L-025

更新时间： 2022-12-14 14:48:00

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
6页	941K
描述
ANALOG ACCELEROMETER

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

1210L-025 数据手册

Model 1210 Analog Accelerometer

BIAS STABILITY CONSIDERATIONS

Bias temperature hysteresis can be minimized by temperature cycling your model 1210 accelerometer after it has

been soldered to your circuit board. If possible, the assembled device should be exposed to ten cycles from -40 to

+85 EC minimum (-55 to +125 EC recommended). The orientation to the Earth's gravitational field during temperature

cycling should preferably be in the same orientation as it will be in the final application. The accelerometer does not

need to have power applied during this temperature cycling.

PACKAGE DIMENSIONS

(20 PIN LEADLESS CERAMIC CHIP CARRIER)

"L" SUFFIX PACKAGE

INCHES

MIN MAX

0.342 0.358

0.346 0.378

0.055 TYP

MILLIMETERS

DIM

MIN

8.69

8.79

MAX

9.09

9.60

TERMINAL 20

TERMINAL 1

1.40 TYP

Positive

0.095 0.115

0.085 TYP

2.41

2.92

Acceleration

2.16 TYP

* M

0.050 BSC

0.025 TYP

0.050 TYP

0.004 x 45°

0.010 R TYP

0.016 TYP

0.048 TYP

0.050 0.070

0.017 TYP

1.27 BSC

0.64 TYP

1.27 TYP

0.10 x 45°

0.25 R TYP

0.41 TYP

1.23 TYP

(20 PIN LEADED CHIP CARRIER)

"J" SUFFIX PACKAGE

1.27

1.78

0.43 TYP

* T

* U

0.023 R TYP

0.085 TYP

0.175 TYP

0.58 R TYP

2.16 TYP

4.45 TYP

NOTES: 1. * DIMENSIONS 'M', 'T' & 'U' LOCATE ACCELERATION SENSING ELEMENT'S CENTER OF MASS .

2. LID IS ELECTRICALLY TIED TO TERMINAL 19 (GND).

3. CONTROLLING DIMENSION: INCH.

4. TERMINALS ARE PLATED WITH 60 MICRO-INCHES MIN GOLD OVER 80 MICRO-INCHES MIN NICKEL.

(THIS PLATING SPECIFICATION DOES NOT APPLY TO THE METALLIZED PIN-1 IDENTIFIER MARK ON

THE BOTTOM OF THE J-LEAD VERSION OF THE PACKAGE).

5. PACKAGE: 90% MINIMUM ALUMINA (BLACK), LID: SOLDER SEALED KOVAR.

SOLDERING RECOMMENDATIONS:

RoHS Compliance: The model 1210 does not contain elemental lead and is RoHS compliant.

WARNING: If no-lead solder is to be used to attach the device, we do not recommend the use of reflow soldering

methods such as vapor phase, solder wave or hot plate. These methods impart too much heat for too long of a

period of time and may cause excessive bias shifts. For no-lead soldering, we only recommend the manual "Solder

Iron Attach" method (listed on the next page of this data sheet). We also do not recommend the use of ultrasonic

bath cleaners because these models contain internal gold wires that are thermo sonically bonded.

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Silicon Designs, Inc. ! 1445 NW Mall Street, Issaquah, WA 98027-5344 ! Phone: 425-391-8329 ! Fax: 425-391-0446

web site: www.silicondesigns.com

[page 4]

Apr 07

1 2 345 6

下载PDF

与1210L-025相关器件

型号	品牌	描述	获取价格	数据表
1210L035	LITTELFUSE	POLYFUSE㈢ Resettable PTCs Surface Mount	获取价格
1210L035/30	LITTELFUSE	1210L系列PTC可为空间极为有限且需要自恢复保护的应用提供表面贴装过电流保护。	获取价格
1210L035/60	LITTELFUSE	1210L系列PTC可为空间极为有限且需要自恢复保护的应用提供表面贴装过电流保护。	获取价格
1210L035WR	LITTELFUSE	1210L Series	获取价格
1210L035YR	LITTELFUSE	1210L Series	获取价格
1210L035YRHF	LITTELFUSE	RESISTOR, TEMPERATURE DEPENDENT, PTC RESETTABLE FUSE, SURFACE MOUNT, CHIP, 1210, HALOGEN F	获取价格