Datasheet > 1206M560KRR

1206M560KRR

更新时间： 2022-12-23 12:52:16

品牌	Logo	应用领域
台基 - CERAMATE		/
页数	文件大小	规格书
9页	248K
描述
Zinc Oxide

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1206M560KRR 数据手册

TYPE

MODEL

PAGE

5/9

SMV1206M□□□KRR

CITATION

SUBJECT

DATE Feb. 03, 2009

lde

ring

C01

REV.

5. SOLDERING RECOMMENDATIONS

5.1 Recommended solder pad layout

1.8~2.5

4.2~5.2

1.2~1.8

（

Unit：mm）

5.2 The SIR test of the solder paste shall be done

5.3 Steel plate and foot distance printing

（

Based on JIS-Z-3284

）

Foot distance printing (mm)

> 0.65mm

Steel Plate thickness (mm)

0.18mm

0.65mm~0.5mm

0.50mm~0.40mm

<=0.40 mm

0.15mm

0.12mm

0.10mm

5.4 IR Soldering

Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and

gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and

solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb

Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal

gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is

essential to minimize thermal shock.

1 2 3 456 7 8 9

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