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1206L175SL PDF预览

1206L175SL

更新时间: 2024-01-11 23:27:13
品牌 Logo 应用领域
力特 - LITTELFUSE /
页数 文件大小 规格书
7页 187K
描述
LoRhoTM Surface Mount Series

1206L175SL 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8533.40.80.70
风险等级:1.57其他特性:MINIMUM RESISTANCE IS 0.005 OHMS
JESD-609代码:e3安装特点:SURFACE MOUNT
端子数量:2最高工作温度:85 °C
最低工作温度:-40 °C封装高度:0.6 mm
封装长度:3.4 mm封装形式:SMT
封装宽度:1.8 mm包装方法:TR, 7 INCH
额定功率耗散 (P):0.8 W参考标准:CUL, TUV, UL
电阻器类型:PTC RESETTABLE FUSE表面贴装:YES
端子面层:Matte Tin (Sn)端子位置:DUAL ENDED
端子形状:WRAPAROUND热敏电阻器应用:OVERCURRENT PROTECTION
工作电压:6 VBase Number Matches:1

1206L175SL 数据手册

 浏览型号1206L175SL的Datasheet PDF文件第1页浏览型号1206L175SL的Datasheet PDF文件第2页浏览型号1206L175SL的Datasheet PDF文件第3页浏览型号1206L175SL的Datasheet PDF文件第5页浏览型号1206L175SL的Datasheet PDF文件第6页浏览型号1206L175SL的Datasheet PDF文件第7页 
®
POLY-FUSE Resettable PTCs  
Surface Mount > LoRhoTM Series  
Environmental Specifications  
Temperature Rerating Curve  
OperatingTemperature  
-40°C to +85°C  
125°C  
170%  
150%  
130%  
Maximum Device Surface  
Temperature inTripped State  
+85°C, 1000 hours  
-/+10% typical resistance change  
110%  
90%  
70%  
Passive Aging  
+85°C, 85% R.H.,100 hours  
-/+15% typical resistance change  
Humidity Aging  
50%  
30%  
10%  
MIL–STD–202, Method 107G  
+85°C/-40°C 20 times  
-30% typical resistance change  
Thermal Shock  
-40 -30 -20 -10  
0
10  
20 30  
Temperature (°C)  
40 50 60 70 80  
MIL–STD–202, Method 215  
No change  
Solvent Resistance  
MIL–STD–883C, Method 2007.1,  
Condition A No change  
Vibration  
Physical Specifications  
Moisture Sensitivity Level  
Level 1, J–STD–020C  
Solder-Plated Copper  
Terminal Material  
Lead Solderability  
(Solder Material: MatteTin (Sn))  
Meets EIA Specification RS186-9E,  
ANSI/J-STD-002, Category 3.  
Soldering Parameters  
Profile Feature  
Pb-Free Assembly  
3°C/second max  
Average Ramp-Up Rate (TS(max) to TP)  
Temperature Min (Ts(min)  
)
150°C  
Temperature Max (Ts(max)  
Time (Min to Max) (ts)  
Temperature (TL)  
)
Pre Heat:  
200°C  
60 – 180 secs  
217°C  
Time Maintained  
Above:  
Temperature (tL)  
60 – 150 seconds  
260+0/-5 °C  
Peak / ClassificationTemperature (TP)  
Time within 5°C of actual peak  
Temperature (tp)  
20 – 40 seconds  
Ramp-down Rate  
6°C/second max  
8 minutes Max.  
-- All temperature refer to topside of the package, measured on the package body surface  
Time 25°C to peakTemperature (TP)  
-- If reflow temperature exceeds the recommended profile, devices may not meet the  
performance requirements  
-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead  
-- Recommended maximum paste thickness is 0.25mm (0.010 inch)  
-- Devices can be cleaned using standard industry methods and solvents  
-- Devices can be reworked using the standard industry practices  
© 2012 Littelfuse, Inc.  
Lo Rho Series  
Specifications are subject to change without notice.  
Please refer to www.littelfuse.com/series/LoRho.html for current information.  
Revised: October 9, 2012  

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