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Datasheet > 1206L075/16WR
1206L075/16WR PDF预览

1206L075/16WR

更新时间： 2024-01-23 09:11:12
品牌 Logo 应用领域
力特 - LITTELFUSE PC
页数 文件大小 规格书
6页 793K
描述
PTC Resettable Fuse, Surface Mount, CHIP, 1206, HALOGEN FREE AND ROHS COMPLIANT

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1206L075/16WR 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active包装说明：CHIP, 1206, HALOGEN FREE AND ROHS COMPLIANT
Reach Compliance Code：compliant风险等级：1.56
Samacsys Confidence：3Samacsys Status：Released
2D Presentation：https://componentsearchengine.com/2D/0T/572661.1.1.pngSchematic Symbol：https://componentsearchengine.com/symbol.php?partID=572661
PCB Footprint：https://componentsearchengine.com/footprint.php?partID=5726613D View：https://componentsearchengine.com/viewer/3D.php?partID=572661
Samacsys PartID：572661Samacsys Image：https://componentsearchengine.com/Images/9/1206L075/16WR.jpg
Samacsys Thumbnail Image：https://componentsearchengine.com/Thumbnails/1/1206L075/16WR.jpgSamacsys Pin Count：2
Samacsys Part Category：FuseSamacsys Package Category：Fuses Chip
Samacsys Footprint Name：1206L035-1Samacsys Released Date：2020-04-12 18:27:47
Is Samacsys：NBase Number Matches：1

1206L075/16WR 数据手册

 浏览型号1206L075/16WR的Datasheet PDF文件第1页浏览型号1206L075/16WR的Datasheet PDF文件第2页浏览型号1206L075/16WR的Datasheet PDF文件第4页浏览型号1206L075/16WR的Datasheet PDF文件第5页浏览型号1206L075/16WR的Datasheet PDF文件第6页 
®
POLY-FUSE Resettable PTCs  
Surface Mount > 1206L Series  
Soldering Parameters  
Profile Feature  
Pb-Free Assembly  
t
P
T
P
Critical Zone  
to t  
Average Ramp-Up Rate (TS(max) to TP)  
Temperature Min (Ts(min)  
3°C/second max  
150°C  
t
L
P
Ramp-up  
)
T
L
S(max)  
t
L
Temperature Max (Ts(max)  
Time (Min to Max) (ts)  
Temperature (TL)  
)
Pre Heat:  
200°C  
T
Ramp-down  
60 – 180 secs  
217°C  
Preheat  
Time Maintained  
Above:  
T
S(min)  
t
Temperature (tL)  
S
60 – 150 seconds  
Peak / ClassificationTemperature (TP)  
260+0/-5 °C  
25  
time to peak temperature  
Time within 5°C of actual peak  
Temperature (tp)  
Time  
20 – 40 seconds  
Ramp-down Rate  
6°C/second max  
8 minutes Max.  
-- All temperature refer to topside of the package, measured on the package body surface  
-- If reflow temperature exceeds the recommended profile, devices may not meet the  
performance requirements  
Time 25°C to peakTemperature (TP)  
-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment  
for lead  
-- Recommended maximum paste thickness is 0.25mm (0.010inch)  
-- Devices can be cleaned using standard industry methods and solvents  
-- Devices can be reworked using the standard industry practices  
Environmental Specifications  
Physical Specifications  
Operating/Storage  
-40°C to +85°C  
Temperature  
Solder-Plated Copper (Solder Material:  
MatteTin (Sn))  
Terminal Material  
Lead Solderability  
Maximum Device Surface  
Meets EIA Specification RS186-9E,  
ANSI/J-STD-002 Category 3.  
Temperature inTripped  
State  
125°C  
+85°C, 1000 hours  
-/+5% typical resistance change  
Passive Aging  
+85°C, 85%, R.H.,1000 hours  
-/+5% typical resistance change  
Humidity Aging  
MIL–STD–202, Method 107  
+85°C/-40°C 20 times  
Thermal Shock  
-30% typical resistance change  
MIL–STD–202, Method 215  
No change  
Solvent Resistance  
Vibration  
MIL–STD–883, Method 2007,  
Condition A  
No change  
Moisture Sensivity Level  
Level 1, J–STD–020  
© 2017 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 03/22/17  
123456

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