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111MT160KBPBF PDF预览

111MT160KBPBF

更新时间: 2024-02-06 14:53:40
品牌 Logo 应用领域
威世 - VISHAY 触发装置可控硅整流器
页数 文件大小 规格书
9页 188K
描述
Silicon Controlled Rectifier, 1600V V(DRM), 1600V V(RRM), 3 Element, INT-A-PAK-9

111MT160KBPBF 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:FLANGE MOUNT, R-XUFM-X9
针数:9Reach Compliance Code:compliant
HTS代码:8541.30.00.80Factory Lead Time:18 weeks
风险等级:5.11Is Samacsys:N
其他特性:UL RECOGNIZED外壳连接:ISOLATED
配置:3 PHASE BRIDGE, HALF-CONTROLLED, COMMON CATHODE最大直流栅极触发电流:150 mA
最大直流栅极触发电压:4 V快速连接描述:3G
螺丝端子的描述:3AK-2CA-CK最大维持电流:200 mA
JESD-30 代码:R-XUFM-X9最大漏电流:20 mA
通态非重复峰值电流:1180 A元件数量:3
端子数量:9最大通态电流:110000 A
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified断态重复峰值电压:1600 V
重复峰值反向电压:1600 V子类别:Silicon Controlled Rectifiers
表面贴装:NO端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
触发设备类型:SCRBase Number Matches:1

111MT160KBPBF 数据手册

 浏览型号111MT160KBPBF的Datasheet PDF文件第1页浏览型号111MT160KBPBF的Datasheet PDF文件第2页浏览型号111MT160KBPBF的Datasheet PDF文件第4页浏览型号111MT160KBPBF的Datasheet PDF文件第5页浏览型号111MT160KBPBF的Datasheet PDF文件第6页浏览型号111MT160KBPBF的Datasheet PDF文件第7页 
5.MT...KPbF, 9.MT...KPbF, 11.MT...KPbF Series  
Three Phase Controlled Bridge  
(Power Modules), 55 A to 110 A  
Vishay High Power Products  
BLOCKING  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
5.MT...K 9.MT...K 11.MT...K UNITS  
RMS isolation voltage  
VISOL  
TJ = 25 °C all terminal shorted, f = 50 Hz, t = 1 s  
4000  
V
Maximum critical rate of rise of  
off-state voltage  
TJ = TJ maximum, linear to 0.67 VDRM  
gate open circuit  
,
dV/dt (1)  
500  
V/μs  
Note  
(1)  
Available with dV/dt = 1000 V/μs, to complete code add S90 i. e. 113MT160KBS90  
TRIGGERING  
PARAMETER  
SYMBOL  
PGM  
TEST CONDITIONS  
5.MT...K 9.MT...K 11.MT...K UNITS  
Maximum peak gate power  
Maximum average gate power  
Maximum peak gate current  
10  
W
PG(AV)  
IGM  
2.5  
TJ = TJ maximum  
2.5  
10  
A
Maximum peak negative  
gate voltage  
- VGT  
TJ = - 40 °C  
TJ = 25 °C  
TJ = 125 °C  
TJ = - 40 °C  
TJ = 25 °C  
TJ = 125 °C  
4.0  
2.5  
1.7  
270  
150  
80  
V
Maximum required DC gate  
voltage to trigger  
VGT  
Anode supply = 6 V,  
resistive load  
Maximum required DC gate  
current to trigger  
IGT  
mA  
Maximum gate voltage  
that will not trigger  
VGD  
IGD  
0.25  
6
V
TJ = TJ maximum, rated VDRM applied  
Maximum gate current  
that will not trigger  
mA  
THERMAL AND MECHANICAL SPECIFICATIONS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
5.MT...K 9.MT...K 11.MT...K UNITS  
Maximum junction operating  
and storage temperature range  
TJ, TStg  
- 40 to 125  
°C  
DC operation per module  
0.18  
1.07  
0.19  
1.17  
0.14  
0.86  
0.15  
0.91  
0.12  
0.70  
0.12  
0.74  
DC operation per junction  
Maximum thermal resistance,  
junction to case  
RthJC  
120 °C rect. conduction angle per module  
120 °C rect. conduction angle per junction  
K/W  
Maximum thermal resistance,  
case to heatsink per module  
RthCS  
Mounting surface smooth, flat and grased  
0.03  
A mounting compound is recommended and  
the torque should be rechecked after a period of  
3 hours to allow for the spread of the  
compound. Lubricated threads.  
to heatsink  
to terminal  
4 to 6  
3 to 4  
Mounting  
torque 10 %  
Nm  
g
Approximate weight  
225  
Document Number: 94353  
Revision: 13-Aug-08  
For technical questions, contact: indmodules@vishay.com  
www.vishay.com  
3

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