RF/Microwave Capacitors
RF/Microwave Multilayer Capacitors (MLC)
100A Series Porcelain Superchip® Multilayer Capacitors
MECHANICAL CONFIGURATION
Body Dimensions
inches (mm)
Lead and Termination
Outline
W/T is a
Series
& Case
Size
Dimensions and Material
Term.
Code
Case Size
& Type
Pkg
Type & Qty
Pkg
Code
MIL-PRF-55681
Termination
Surface
Length
(L)
Width
(W)
Thickness
(T)
Overlap
Materials
(Y)
T&R, 1000 or
500 pcs
T1K or T
TV1K or
TV
Y
Y
Y
Y
Tin/ Lead, Solder
Plated over Nickel
A
.055+.015 -.010 .055 ±.015
(1.40+0.38-0.25) (1.40 ±0.38)
W
100A
100A
100A
100A
W
P
CDR12BG
Vertical T&R,
Solder
Plate
L
L
L
L
T
T
T
T
Barrier Termination 1000 or 500 pcs
Cap Pac, 100 pcs
C100
T&R, 1000 or
T1K or T
TV1K or
TV
Heavy Tin/ Lead
Coated, over Nickel
500 pcs
.055+.025 -.010 .055 ±.015
(1.40+0.64-0.25) (1.40 ±0.38)
A
Pellet
W
W
W
CDR12BG
N/A
Vertical T&R,
Barrier Termination 1000 or 500 pcs
Cap Pac, 100 pcs
C100
.057
(1.45)
max.
.010 + .010 - .005
(0.25 + 0.25 - 0.13)
T&R, 1000 or
RoHS Compliant
500 pcs
T1K or T
TV1K or
TV
A
.055+.015 -.010 .055 ±.015
(1.40+0.38-0.25) (1.40 ±0.38)
Tin Plated over
Vertical T&R,
Solderable
Nickel
T
Nickel Barrier
Termination
1000 or 500 pcs
Cap Pac, 100 pcs
C100
Barrier
T&R, 1000 or
RoHS Compliant
500 pcs
T1K or T
TV1K or
TV
.055+.015 -.010 .055 ±.015
(1.40+0.38-0.25) (1.40 ±0.38)
Gold Plated over
Vertical T&R,
A
CA
CDR11BG
Nickel Barrier
Gold Chip
1000 or 500 pcs
Termination
C100
Cap Pac, 100 pcs
NON-MECHANICAL CONFIGURATION
Body Dimensions
inches (mm)
Lead and Termination
Outline
Series
Dimensions and Material
Overlap
Term.
Code
Case Size
& Type
W/T is a
Termination
Surface
Pkg
Type & Qty
Pkg
Code
& Case
Size
MIL-PRF-55681
Length
(L)
Width
(W)
Thickness
(T)
Materials
(Y)
T&R, 1000 or
500 pcs
Vertical T&R,
1000 or 500 pcs
Cap Pac, 100 pcs
T&R, 1000 or
500 pcs
Vertical T&R,
1000 or 500 pcs
Cap Pac, 100 pcs
T&R, 1000 or
500 pcs
Vertical T&R,
1000 or 500 pcs
Cap Pac, 100 pcs
Tin/ Lead, Solder
Plated over
T1K or T
TV1K or
TV
Y
Y
Y
A
Meets
.055+.015 -.010 .055 ±.015
(1.40+0.38-0.25) (1.40 ±0.38)
W
100A
100A
100A
WN
PN
TN
Solder
Plate
Requirements
Non-Magnetic
L
L
L
T
T
T
Barrier Termination
C100
Heavy Tin/ Lead
Coated, over
Non-Magnetic
Barrier Termination
T1K or T
TV1K or
TV
.057
(1.45)
max.
Meets
Requirements
.055+.025 -.010 .055 ±.015
(1.40+0.64-0.25) (1.40 ±0.38)
.010 + .010 - .005
(0.25 + 0.25 - 0.13)
A
Pellet
W
C100
RoHS Compliant
Tin Plated over
Non-Magnetic
Barrier Termination
T1K or T
TV1K or
TV
A
Meets
Requirements
.055+.015 -.010 .055 ±.015
(1.40+0.38-0.25) (1.40 ±0.38)
Solderable
Nickel
W
C100
Barrier
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
439
TDS-RFM-0005 | Rev 1
rf microwave products
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