R
UMW
1.5SMC6.8A(CA) THRU 1.5SMC540A(CA)
6.8V-540V 1500W
FEATURES
• Low profile package with built-in strain relief for
surface mounted applications
• Glass passivated junction
SMC(DO-214AB)
Cathode Band
• Low incremental surge resistance
• Low inductance
0.155(3.94)
0.130(3.30)
0.246(6.22)
0.220(5.59)
• Excellent clamping capability
• 1500W peak pulse power capability with a 10/1000µs
waveform, repetition rate (duty cycle): 0.01%
• Very fast response time
0.280(7.11)
0.260(6.60)
0.012(0.305)
0.006(0.152)
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
0.103(2.62)
0.079(2.06)
0.060(1.52)
0.030(0.76)
0.008(0.2)
0(0)
MECHANICAL DATA
0.320(8.13)
0.305(7.75)
Case: JEDEC DO-214AB (SMC) molded plastic over
passivated junction
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026. High temperature soldering: 250°C/10
seconds at terminals.
Dimensions in inches and (millimeters)
Polarity: For uni-directional types the band denotes the
cathode, which is positive with respect to the anode
under normal TVS operation.
Standard Packaging: 16mm tape (EIA STD RS-481)
Weight: 0.007 oz., 0.21 g
Packaging Codes – Options (Antistatic):
51 – 1K per Bulk box, 10K/carton
57 – 850 per 7" plastic Reel (16mm tape), 8.5K/carton
9A – 3.5K per 13" plastic Reel (16mm tape), 35K/carton
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Value
Unit
Peak power dissipation with a 10/1000µs waveform
PPPM
1500
W
Maximum Instantaneous Forward Voltage at
50.0A for Unidirectional Only
VF
3.5
6.5
Volts
W
Power dissipation on infinite heatsink, TA = 50°C
PM(AV)
IFSM
Peak forward surge current 8.3ms single half sine-wave
uni-directional only(2)
200
A
Thermal resistance junction to ambient air(3)
RθJA
RθJL
75
15
°C/W
°C/W
Thermal resistance junction to leads
Operating junction and storage temperature range
TJ, TSTG
–65 to +150
°C
Notes: (1) Non-repetitive current pulse, per Fig.3 and derated above TA = 25°C per Fig. 2
(2) Mounted on 0.31 x 0.31” (8.0 x 8.0mm) copper pads to each terminal
(3) Mounted on minimum recommended pad layout
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