TCP Series - DSCC 09009
TCP Series Low ESR Tantalum Modules
TCP Series tantalum modules
a wide range of SMT board assembly
processes including reflow solder or
conductive epoxy.
represent high packing density for
applications utilizing multiple com-
ponents in a parallel configuration,
and are available with testing to
DSCC 09009.
There are two termination finishes
available: hot solder dipped (“C”) and
gold plated (“B”).
These modules feature stacked
assemblies of CWR29 capacitors
which provide ultra low ESR and uti-
lize established reliability capacitors
(Weibull Grade voltage conditioning)
in accordance with MIL-PRF-55365.
They can also be supplied with
SRC9000 Space Level components.
The molding compound has been
selected to meet the requirements of
UL94V-0 and outgassing require-
ments of ASTM E-595.
For moisture sensitivity levels please
refer to the High Reliability Tantalum
MSL section located in the back of
the High Reliability Tantalum Catalog.
W
L
The stacked construction of fully
molded capacitors is compatible with
Note: Additional form factors and ratings are available.
Contact plant for details.
H
CAPACITANCE AND RATED VOLTAGE
CASE SIZE (ESR IN m⍀)
Capacitance
Rated voltage DC (VR) to 85ºC
μF
9.4
18.8
20
28.2
40
60
Code
945
196
206
286
406
606
666
946
137
197
207
207
287
407
447
607
667
887
138
208
6V
10V
15V
20V
25V
35V
50V
2H (200)
4H (100)
2H (200)
6H (67)
4H (100)
6H (67)
66
94
2H (85)
4H (43)
6H (28)
2H (75)
4H (38)
132
188
198
200
282
400
440
600
660
880
1,320
1,980
2H (63)
4H (31)
6H (21)
6H (25)
2H (50)
2H (50)
4H (25)
6H (17)
4H (25)
6H (17)
FEBRUARY 2015 ■ 27