HIGH VOLTAGE MLCC
◆可靠性测试 Reliability Test
项目
技术规格
Technical Specification
测 试 方 法
Item
Test Method and Remarks
项目
Item
C0G
X7R
Y5V
将电容在 100~200℃的温度下预热 10±2 分钟.
浸锡温度: 265±5℃
≤±0.5%或±0.5PF,
取较大值
-5% ~
+10%
-10% ~
+20%
浸锡时间: 10±1s
ΔC/C
≤±0.5% or ±0.5PF,
whichever is larger
同初始标准
Same to initial value.
同初始标准
然后取出溶剂清洗干净,在 10 倍以上的显微镜底下观察.
放置时间:24±2 小时 放置条件:室温
Preheating conditions: 100 to 200℃; 10±2min.
耐焊接热
Resistance to
Soldering
Heat
DF
IR
Solder Temperature: 265±5℃
Duration: 10±1s
Clean the capacitor with solvent and examine it with a
10X(min.) microscope.
Same to initial value.
外观:无可见损伤 上锡率:≥95%
Recovery Time: 24±2h
Recovery condition: Room temperature
Appearance:No visible damage.At least 95% of the
terminal electrode is covered by new
solder.
试验基板:Al2O3 或 PCB
施压速度:1mm/sec.
弯曲深度:1mm
单位:mm
应在弯曲状态下进行测量。
Test Board: Al2O3 or PCB
Speed: 1mm/sec.
外观:无可见损伤.
Appearance: No visible damage.
Warp: 1mm
Unit: mm
The measurement should be made with the board in
the bending position.
ΔC/C:
Ⅰ类:≤±1%或±1pF ,取两者中最大者
抗弯曲强度
Resistance to
Flexure of
Substrate
(Bending
Strength)
Ⅱ类:
B,X,BS,DS: ≤±10%
E,F: ≤±20%
ClassⅠ: ≤±1% or ±1pF,whichever is larger.
ClassⅡ:
B,X,BS,DS: ≤±10%
E,F: ≤±20%
ΔC/C
≤±10%
预处理※(2 类):上限类别温度,1 小时 恢复:24±1h
Preheating conditions: up-category temperature, 1h
Recovery time: 24±1h
项目
Item
C0G
X7R
Y5V
初始测量 Initial Measurement
≤±1%或±1PF,取
较大值
循环次数:5 次,一个循环分以下 4 步:
Cycling Times: 5 times, 1 cycle, 4 steps:
-10% ~
+10%
-20% ~
+20%
ΔC/C
≤±1% or ±1pF ,
whichever is larger
阶段
Step
1
温度(Temperature)
时间(Time)
温度循环
Temperature
Cycle
下限温度(Low- category temp.):
(NPO/X7R:-55℃ Y5V:-25℃)
30min
2
3
常温(Normal temp.) : +20℃
2~3min
30min
上限温度(Up- category temp.)
(NPO/X7R: +125℃ Y5V:+85℃)
4
常温(Normal temp.) : +20℃
2~3min
试验后放置(恢复)时间:24±2h
Recovery time after test: 24±2h
端头结合强度
Termination
Adhesion
外观无可见损伤
No visible damage.
施加的力:5N
Applied Force: 5N
时间:10±1S
Duration: 10±1S