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04023J1R6BBSTR\500 PDF预览

04023J1R6BBSTR\500

更新时间: 2023-09-23 07:41:41
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
19页 217K
描述
Thin Film Capacitor

04023J1R6BBSTR\500 数据手册

 浏览型号04023J1R6BBSTR\500的Datasheet PDF文件第13页浏览型号04023J1R6BBSTR\500的Datasheet PDF文件第14页浏览型号04023J1R6BBSTR\500的Datasheet PDF文件第15页浏览型号04023J1R6BBSTR\500的Datasheet PDF文件第16页浏览型号04023J1R6BBSTR\500的Datasheet PDF文件第18页浏览型号04023J1R6BBSTR\500的Datasheet PDF文件第19页 
®
®
Accu-F / Accu-P  
Application Notes  
GENERAL  
HANDLING  
Accu-F® and Accu-P® SMD capacitors are designed for  
soldering to printed circuit boards or other substrates. The  
construction of the components is such that they will with-  
stand the time/temperature profiles used in both wave and  
reflow soldering methods.  
SMD capacitors should be handled with care to avoid damage  
or contamination from perspiration and skin oils. The use of  
plastic tipped tweezers or vacuum pick-ups is strongly recom-  
mended for individual components. Bulk handling should  
ensure that abrasion and mechanical shock are minimized. For  
automatic equipment, taped and reeled product gives the  
ideal medium for direct presentation to the placement  
machine.  
1
CIRCUIT BOARD TYPE  
COMPONENT PAD DESIGN  
The circuit board types which may be used with Accu-F® and  
Component pads must be designed to achieve good  
joints and minimize component movement during reflow  
soldering. Pad designs are given below for both wave and  
reflow soldering.  
Accu-P® are as follows:  
Accu-F®: All flexible types of circuit boards  
(eg. FR-4, G-10).  
Accu-P®: All flexible types of circuit boards  
(eg. FR-4, G-10) and also alumina.  
For other circuit board materials, please consult factory.  
The basis of these designs is:  
a. Pad width equal to component width. It is permissible to  
decrease this to as low as 85ꢁ of component width but  
it is not advisable to go below this.  
b. Pad overlap 0.5mm beneath large components. Pad  
overlap about 0.3mm beneath small components.  
c. Pad extension of 0.5mm for reflow of large components  
and pad extension about 0.3mm for reflow of small com-  
ponents. Pad extension about 1.0mm for wave soldering.  
WAVE SOLDERING  
DIMENSIONS: millimeters (inches)  
1.5  
(0.059)  
1.5  
(0.059)  
5.0  
(0.197)  
0.8  
(0.031)  
0.26  
1.2  
(0.047)  
1.25  
(0.049)  
4.0  
(0.157)  
(0.010)  
2.0  
(0.079)  
0.40  
1.0  
(0.039)  
(0.016)  
2.1  
(0.083)  
0.5  
(0.020)  
1.06  
(0.042)  
3.1  
(0.122)  
3.1  
(0.122)  
0.6  
(0.024)  
0.7  
(0.028)  
0.40  
(0.016)  
0.8  
(0.031)  
0.34  
(0.013)  
1.5  
(0.059)  
1.25  
(0.049)  
1.2  
(0.047)  
1.5  
(0.059)  
0.55  
(0.022)  
1.25  
(0.049)  
0.8  
(0.031)  
0.8  
(0.031)  
2.5  
(0.098)  
0603  
0805  
1210  
Accu-P®  
0201  
Accu-P®  
0402  
Accu-P®  
0603  
Accu-F®  
Accu-P®  
Accu-F®  
Accu-P®  
REFLOW SOLDERING  
DIMENSIONS: millimeters (inches)  
1.0  
(0.039)  
1.0  
4.0  
(0.157)  
0.26  
(0.010)  
0.8  
0.85  
(0.039)  
(0.031)  
(0.033)  
0.26  
(0.010)  
2.0  
(0.079)  
0.6  
3.0  
(0.024)  
2.3  
(0.091)  
2.3  
(0.091)  
0.6  
(0.024)  
(0.118)  
0.7  
(0.028)  
1.7  
(0.068)  
1.0  
(0.039)  
0.78  
(0.030)  
0.5  
(0.020)  
0.85  
(0.033)  
0.8  
(0.031)  
0.6  
(0.024)  
0.34  
(0.013)  
0.26  
(0.010)  
1.0  
(0.039)  
1.0  
(0.039)  
0.8  
(0.031)  
0.8  
(0.031)  
0.55  
(0.022)  
1.25  
(0.049)  
2.5  
(0.098)  
0603  
0805  
1210  
Accu-P®  
0201  
Accu-P®  
0402  
Accu-P®  
0603  
Accu-P®  
Accu-F®  
Accu-P®  
Accu-F®  
22  

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