Cannon KJL/KJ/KJA/KJB
MIL-DTL-38999 Series I, II, III Connectors
SERIES I
SERIES II
SERIES III
SHELL HARDWARE
is aluminum alloy
GROUNDING FINGERS
(Standard on Series I connector)
MONOBLOC
INSERT
WIRE SEALING
GROMMET
HIGH STRENGTH
MULTIPLE-TINE
METAL RETAINING CLIP
assures positive retention with
inwardly deflected tines that lock
securely behind contact shoulder
HIGH STRENGTH
MULTIPLE-TINE
CLOSED ENTRY
SOCKET CONTACT
DESIGN
METAL RETAINING CLIP
assures positive retention with
inwardly deflected tines that lock
securely behind contact shoulder
INSULATOR
TO SHELL SEAL
SIMPLE, STRONGER
CONTACTS
are designed to resist
bending and are
crimp terminated
INSULATOR
TO SHELL SEAL
WIRE SEALING
GROMMETS
SIMPLE, STRONGER
CONTACTS
are designed to resist
bending and are
crimp terminated
WIRE SEALING
GROMMETS
PERIPHERAL
SEALING
GASKET
PERIPHERAL
SEALING
GASKET
CLOSED ENTERY
SOCKET CONTACT
DESIGN
INTERFACIAL
SEAL
PERIPHERAL SEAL
around the connector interface is
designed to minimize compression
set when connectors are mated
GROUNDING FINGERS
SIMPLER, STRONGER
CONTACTS
are designed to resist bending
and are crimp terminated
HIGH STRENGTH
MULTIPLE-TINE
RESILIENT PIN
INTERFACIAL
SEAL
METAL RETAINING CLIP
assures positive retentin with
inwardly deflected tines that lock
securely behind contact shoulder
INTERFACIAL SEALS
feature individual raised seal
barriers around each pin contact
• Corrosion and zinc resistant shells of aluminum
alloy with cadmium and zinc over nickel plating
withstand a 500 hour salt spray exposure
• Rear release crimp snap-in contacts
• High contact density
• Standard MIL-C-39029 contacts, MIL-I-81969 appli-
cation tools and MIL-STD 1560 insert
arrangements
• Special/custom capabilities
• Interfacial seal helps prevent electrolytic erosion of
contacts - Series III
• Superior EMI shielding provides outstanding pro-
tection up to 65dB at 10 GHZ. - Series III
• 100% scoop-proof - Series I and III
• Light weight /Low Profile - Series II
• Operates under severe high temperature vibration
testing through 200 C - engineered for high densi-
ty circuitry - Series III
Specification Comparison
Design Criteria
Low Profile/Light Weight
Scoop Proof
Series I
Series II
yes
Series III
no
no
yes
no
yes
Coupling System
Electrolytic Erosion
Durability (Cycles)
High Impact Shock
External Bending Moment
Shell Size 25
Bayonet
no
Bayonet
no
Triple Lead Thread
yes
500
yes
500
250
yes
no
650 in/lbs
Ambient
30G, Ambient
yes
150 in/lbs
Ambient
1000 in/lbs
Random Vibration "J"
Sine Vibration
492 F
60G, -85 to +392 F
Sand, Dust, Ice
yes
Shell Size
9-25
8-24
9-25
Contact Rating
Crimp Well Data
Contact
Size
Test Current
DC Test Amperage
Maximum
Millivolt Drop*
Well
Diameter
Well
Depth
22D
22M**
22**
20
5
40
30
40
35
25
25
.0345 .0010
.0280 .0010
.0365 .0010
.0470 .0010
.0670 .0010
.1000 .0020
.157/.141
.157/.141
.157/.141
.229/.209
.229/.209
.229/.209
3
5
7.5
13
23
16
12
* Maximum millivolt drop data is determined by measuring resistance of mated contacts from end to en
** For reference only
Dimensions shown in inches (mm)
Specifications and dimensions subject to change
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