ZXMP10A17K
P-CHANNEL HIGH VOLTAGE MOSFET
FEATURES
VDS=-100V,RDS(ON)≤350mΩ@VGS=-10V,ID=-3.9A
Low Input Capacitance and Fast switching speed
Low gate drive
For Power Management Functions and DC-DC Converters Applications
For Disconnect switches and Motor control Applications
Surface Mount device
TO-252
MECHANICAL DATA
Case: TO-252(DPAK)
Case Material: Molded Plastic. UL flammability
Classification Rating: 94V-0
Weight: 0.33 grams (approximate)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Parameter
Drain-source voltage
Symbol
Value
Unit
V
VDS
-100
±20
VGS
Gate-source voltage
V
TA = +25°C(Note2)
-3.9
Continuous drain current, VGS = -10V
TA= +70°C(Note2)
TA = +25°C(Note1)
(Note3)
ID
-3.1
A
-2.4
IDM
IS
Pulsed drain current VGS= -10V
-11.3
-8.7
A
A
A
Maximum Body Diode Forward Current
Pulsed source current (body diode)
(Note2)
ISM
(Note3)
-11.3
4.0
TA = +25°C(Note1)
TA= +25°C(Note2)
TA = +25°C(Note5)
(Note1)
Power dissipation
PD
10.2
2.0
W
31
RθJA
Thermal resistance from Junction to ambient (Note2)
(Note5)
12.3
62
°C/W
RθJL
Thermal Resistance, Junction to Case (Note4)
Operating and Storage temperature
2.4
°C/W
°C
TJ,TSTG
-55 ~+150
Notes: 1. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in
still air conditions; the device is measured when operating in a steady-state condition.
2. Same as note (1), except the device is measured at t ≤ 10 sec.
3. Same as note (1), except the device is pulsed with D= 0.02 and pulse width 300μs. The pulse current is limited by the
maximum junction temperature.
4. Thermal resistance from junction to solder-point (at the end of the drain lead).
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions; the device is measured when operating in a steady-state condition.
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