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ZXMN15A27K PDF预览

ZXMN15A27K

更新时间: 2024-06-27 12:12:28
品牌 Logo 应用领域
合科泰 - HOTTECH /
页数 文件大小 规格书
7页 809K
描述
TO-252

ZXMN15A27K 数据手册

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ZXMN15A27K  
N-CHANNEL HIGH VOLTAGE MOSFET  
FEATURES  
VDS=150V,RDS(ON)≤650mΩ@VGS=10V,ID=2.6A  
Low input capacitance  
Low on-resistance  
Fast switching speed  
High avalanche energy pulse withstand capability  
For Power Management Functions and SLIC line drivers for VoIP applications  
For Transformer Driving Switch and Motor control Applications  
For Uninterrupted power supply Applications  
Surface Mount device  
TO-252  
MECHANICAL DATA  
Case: TO-252(DPAK)  
Case Material: Molded Plastic. UL flammability  
Classification Rating: 94V-0  
Weight: 0.33 grams (approximate)  
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Parameter  
Drain-source voltage  
Symbol  
VDS  
Value  
150  
±25  
Unit  
V
VGS  
Gate-source voltage  
V
TC = +25°C(Note2)  
TC= +70°C(Note2)  
TC = +25°C(Note1)  
2.55  
2.0  
1.7  
Continuous drain current, VGS = 10V  
ID  
A
IDM  
EAS  
IAS  
Pulsed drain current (VGS=10V,Note3)  
Single Pulsed Avalanche Energy(Note6)  
Single Pulsed Avalanche Current(Note6)  
Repetitive Avalanche Energy(Note3)  
Repetitive Avalanche Current(Note3)  
Continuous Source current (Body diode)(Note2)  
Pulsed Source current (Body diode)(Note3)  
17.2  
55  
4.3  
3.0  
4.3  
5.2  
17.2  
4.2  
A
mJ  
A
mJ  
A
EAR  
IAR  
IS  
A
A
ISM  
Note1  
Note2  
Power dissipation  
PD  
9.5  
W
Note5  
Note1  
Note2  
2.2  
30.2  
13.1  
58.1  
2.06  
-55 ~+150  
RθJA  
Thermal resistance from Junction to ambient  
°C/W  
Note5  
RθJL  
Thermal Resistance, Junction to Lead (Note4)  
Operating and Storage temperature  
°C/W  
°C  
TJ,TSTG  
Notes:1. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in  
still air conditions; the device is measured when operating in a steady-state condition.  
2. Same as note 1, except the device is measured at t ≤ 10 sec.  
3. Same as note 1, except the device is operating in a repetitive state with pulse width and duty cycle limited by maximum  
junction temperature.  
4. Thermal resistance from junction to solder-point (at the end of the drain lead).  
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with the high coverage single sided 1oz copper, in  
still air conditions; the device is measured when operating in a steady-state condition.  
6. UIS in production with L = 5.95mH, IAS = 4.3A, RG = 25Ω, VDD = 100V, starting TJ = 25°C.  
1 / 7  
©GUANGDONG HOTTECH INDUSTRIAL CO.,LTD  
E-mail:hkt@heketai.com  

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