ZXMN10A25K
N-CHANNEL HIGH VOLTAGE MOSFET
FEATURES
VDS=100V,RDS(ON)≤125mΩ@VGS=10V,ID=6.4A
Low input capacitance
Low on-resistance
Fast switching speed
For Power Management Functions and DC-DC Converters Applications
For Disconnect switches and Motor control Applications
For Uninterrupted power supply Applications
Surface Mount device
TO-252
MECHANICAL DATA
Case: TO-252(DPAK)
Case Material: Molded Plastic. UL flammability
Classification Rating: 94V-0
Weight: 0.33 grams (approximate)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Parameter
Drain-source voltage
Symbol
VDS
Value
Unit
V
100
±20
VGS
Gate-source voltage
V
TC = +25°C(NOTE2)
6.4
Continuous drain current, VGS = 10V
TC= +70°C(NOTE2)
TC = +25°C(NOTE1)
ID
5
A
4.2
IDM
IS
Pulsed drain current (Note3)
21
A
A
A
Continuous Source current (Body diode)(Note2)
Pulsed Source current (Body diode)(Note3)
10
ISM
21
NOTE 1
NOTE 2
4.25
9.85
2.11
29.4
12.7
59.1
1.43
-55 ~+150
Power dissipation
PD
W
NOTE 5
NOTE 1
NOTE 2
RθJA
Thermal resistance from Junction to ambient
°C/W
NOTE 5
RθJL
Thermal Resistance, Junction to Lead (NOTE4)
Operating and Storage temperature
°C/W
°C
TJ,TSTG
Notes:1. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in
still air conditions; the device is measured when operating in a steady-state condition.
2. Same as note 1, except the device is measured at t ≤ 10 sec.
3. Same as note 1, except the device is pulsed with D = 0.02 and pulse width 300 μs. The pulse current is limited by the
maximum junction temperature.
4. Thermal resistance from junction to solder-point (at the end of the drain lead).
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with the high coverage single sided 1oz copper, in
still air conditions; the device is measured when operating in a steady-state condition.
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E-mail:hkt@heketai.com