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ZVP4525Z PDF预览

ZVP4525Z

更新时间: 2024-11-18 18:10:03
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合科泰 - HOTTECH /
页数 文件大小 规格书
6页 670K
描述
SOT-89

ZVP4525Z 数据手册

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ZVP4525Z  
HIGH VOLTAGE MOSFET (P-CHANNEL)  
FEATURES  
Low on-resistance:VDS=-250V,RDS(ON)≤14Ω@VGS=-10V,ID=-205mA  
Low threshold and Low gate drive  
High voltage and Fast switching speed  
Complementary N-channel Type ZVN4525Z  
Surface Mount device  
SOT-89  
MECHANICAL DATA  
Case: SOT-89  
Case Material: Molded Plastic. UL flammability  
Classification Rating: 94V-0  
Weight: 0.055 grams (approximate)  
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Parameter  
Drain-source voltage  
Symbol  
VDS  
Value  
-250  
Unit  
V
Gate-source voltage  
VGS  
±40  
V
(VGS=10V; TA=25°C)(a)  
(VGS=10V; TA=70°C)(a)  
-200  
-164  
-1.0  
mA  
mA  
A
Continuous drain current  
ID  
IDM  
Pulsed drain current (c)  
Continuous Source Current (Body Diode)  
Pulsed Source Current (Body Diode)  
Power dissipation at TA=25°C(a)  
Junction to Ambient (a)  
Junction to Ambient (b)  
Operating and Storage temperature  
IS  
ISM  
PD  
-0.75  
-1  
1.2  
103  
50  
A
A
W
°C/W  
°C/W  
°C  
RθJA  
TJ,TSTG  
-55 ~+150  
NOTES:(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,in still air conditions  
(b) For a device surface mounted on FR4 PCB measured at t5 secs.  
(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.  
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)  
Parameter  
Drain-Source breakdown voltage  
Gate-threshold voltage  
Gate-body leakage current  
Zero gate voltage drain current  
Symbol Min Typ Max Unit  
Conditions  
VGS=0V, ID=-1mA  
VDS=VGS, ID=-1mA  
VDS=0V,  
VGS=±40V  
VDS=-250V,  
VGS=0V  
V(BR)DSS  
VGS(th)  
IGSS  
-250 -285  
V
V
nA  
nA  
Ω
-0.8  
-1.5  
±1  
-2.0  
±100  
-500  
14  
IDSS  
-30  
10  
VGS=-10V, ID=-200mA  
VGS=-3.5V, ID=-100mA  
Drain-source on-resistance (1)  
RDS(ON)  
13  
18  
Ω
Forward Trans-conductance (3)  
Input capacitance(3)  
Output capacitance(3)  
Reverse transfer capacitance(3)  
Turn-on delay time(2)(3)  
Turn-on rise time(2)(3)  
Turn-off delay time(2)(3)  
Turn-off fall time(2)(3)  
Total Gate Charge(2)(3)  
Gate-Source Charge(2)(3)  
Gate Drain Charge(2)(3)  
Diode Forward Voltage (1)  
Reverse Recovery Time (3)  
Reverse Recovery Charge (3)  
gf  
80  
200  
73  
mS VDS=-10V, ID=-150mA  
pF  
s
Ciss  
Coss  
Crss  
td(on)  
tr  
td(off)  
tf  
Qg  
Qgs  
Qgd  
VSD  
trr  
VDS=-25V, VGS=0V, f=1MHz  
12.8  
3.91  
1.53  
3.78  
17.5  
7.85  
2.45 3.45  
0.22 0.31  
0.45 0.63  
0.97  
pF  
pF  
nS  
nS  
nS  
nS  
nC  
nC  
nC  
V
VDD=-30V,ID=-200mA,  
VGS=-10V,RG=50Ω,  
VDS=-25V, VGS=0V, ID=-200mA  
IS=-200mA,  
VGS=0V  
205  
21  
290  
29  
nS  
nC  
IF=-200mA, dI/dt=100A/µS  
Qrr  
Note: (1) Measured under pulsed conditions. Width=300μs. Duty cycle 2%.  
(2)Switching characteristics are independent of operating junction temperature.  
(3)For design aid only, not subject to production testing.  
1 / 4  
©GUANGDONG HOTTECH INDUSTRIAL CO.,LTD  
E-mail:hkt@heketai.com  

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