ZSSC3218
High-End 18-Bit Sensor Signal
Conditioner
Datasheet
Brief Description
Benefits
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Integrated 26-bit calibration math digital signal
processor (DSP)
The ZSSC3218 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential or
pseudo-differential input signal. Designed for high-
resolution sensor module applications, the
ZSSC3218 can perform offset, span, and 1st and 2nd
order temperature compensation of the measured
signal. Developed for correction of resistive bridge or
absolute voltage sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
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Fully corrected signal at digital output
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
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One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering com-
ponents required
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Highly integrated CMOS design
Integrated reprogrammable non-volatile memory
Excellent for low-voltage and low-power battery
applications
The measured and corrected sensor values are
provided at the digital output pins, which can be
configured as I2C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via a
26-bit internal digital signal processor (DSP) running
a correction algorithm. Calibration coefficients are
stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3218 is simple via the serial
interface. The interface is used for the PC-controlled
calibration procedure, which programs the set of
calibration coefficients in memory. The ZSSC3218
provides accelerated signal processing, increased
resolution, and improved noise immunity in order to
support high-speed control, safety, and real-time
sensing applications with the highest requirements
for energy efficiency.
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Optimized for operation in calibrated resistive
(e.g., pressure) sensor or calibrated absolute
voltage (e.g., thermopile) sensor modules
Physical Characteristics
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Supply voltage range: 1.68V to 3.6V
Current consumption: 1.0mA (operating mode)
Sleep State current: 20nA (typical)
Temperature resolution: <0.003K/LSB
Best-in-class energy-efficiency:
with 16-bit resolution: <140pJ/step
with 18-bit resolution: <50pJ/step
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Operation temperature: –40°C to +85°C
Small die size
Delivery options: die for wafer bonding
* I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
Features
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Flexible, programmable analog front-end design;
up to 18-bit analog-to-digital converter (ADC)
ZSSC3218 Application Example
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Fully programmable gain amplifier for optimizing
sensor signals: gain range 6.6 to 216 (linear)
VSS
VDD
Battery
VDD
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Internal auto-compensated temperature sensor
Stacked-Die Sensor Module
VDD
Digital compensation of individual sensor offset;
1st and 2nd order digital compensation of sensor
gain as well as 1st and 2nd order temperature gain
and offset drift
ZSSC3218
SS
VSS
VSS
VDDB
INP(+)
SS
MOSI
SDA
RES
RES
INP
sensor element
SCLK
SCL
VDDB
INN
Microcontroller
VSSB
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Programmable interrupt operation
EOC
EOC
MOSI
SDA
INN(-)
VSSB
High-speed sensing: e.g. 16-bit conditioned
sensor signal measurement rate >500s-1
MISO
MISO
SCLK
SCL
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Typical sensor elements can achieve an accu-
racy of better than ±0.10% FSO** at -40 to 85°C
© 2016 Integrated Device Technology, Inc.
1
April 20, 2016