ZSSC3016
Low Power, High Resolution
Datasheet
16-Bit Sensor Signal Conditioner
Brief Description
Benefits
The ZSSC3016 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3016 can perform offset,
span, and 1st and 2nd order temperature compensa-
tion of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
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Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
Minimize calibration costs through the one-pass
calibration concept
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No external trimming components required
Highly integrated CMOS design
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
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Excellent for low-voltage and low-power battery
applications
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I2C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP)
running a correction algorithm. Calibration coeffici-
ents are stored on-chip in a highly reliable, non-
volatile, multiple-time programmable (MTP) memory.
Programming the ZSSC3016 is simple via the serial
interface and the PC-controlled calibration software
provided in the IDT Development Kit. The interface
is used for the PC-controlled calibration procedure,
which programs the set of calibration coefficients in
memory. The digital mating is fast and precise,
eliminating the overhead normally associated with
trimming external components and multi-pass
calibration routines.
Support
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Evaluation Kit
Physical Characteristics
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Supply voltage range: 1.8 to 3.6V
Current consumption: 1mA (operating mode)
Sleep State current: 70nA (25°C)
Temperature resolution: <0.003K/LSB
Operation temperature: –40°C to +85 °C
Small die size
Delivery options: die for wafer bonding
ZSSC3016 Application Example
Features
VSS
VDD
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Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing, two-
segment analog-to-digital converter (ADC)
Battery
EOC
VSS
VDD
Sensor Module
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Fully programmable gain amplifier for optimizing
sensor signals: gain range 14 to 72 (linear factor)
VDD
EOC
SEL
SEL
SS
VSS
ZSSC3016
SS
VSSB
4
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Internal auto-compensated temperature sensor
Microcontroller
INN
3
2
1
MISO
MISO
Sensor
Bridge
Digital compensation of individual sensor offset;
1st and 2nd order digital compensation of sensor
gain
Digital compensation of 1st and 2nd order temper-
ature gain and offset drift
VDDB
INP
MOSI
SDA
MOSI_SDA
SCLK_SCL
SCLK
SCL
VPP
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VPP
6.75V
voltage for setup
…
programming
& calibration
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Intelligent power management unit
* I2C™ is a trademark of NXP.
Typical sensor elements can achieve accuracy of
better than ±0.10% FSO @ -40 to 85 °C
© 2016 Integrated Device Technology, Inc.
1
January 25, 2016
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