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Z Form PDF预览

Z Form

更新时间: 2024-11-15 14:51:47
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TTELEC /
页数 文件大小 规格书
2页 340K
描述
NRND Surface mount leadforming option for resistors

Z Form 数据手册

 浏览型号Z Form的Datasheet PDF文件第2页 
Note - Not recommended for  
new designs. There are no EOL  
plans for Z-form, but for new  
designs the newer ZI-form is  
recommended.  
Resistors  
Z-form SMD  
Leadform Option  
Z-Form  
SMD power resistors up to 5W  
ꢀ Air-cooledꢀformꢀpreventsꢀPCBꢀoverheaꢁng  
ꢀ Approvedꢀaxialsꢀcanꢀbeꢀre-usedꢀinꢀSMDꢀdesigns  
ꢀ Precision,ꢀfusibleꢀ&ꢀhighꢀvoltageꢀalsoꢀavailable  
ꢀ Compaꢁbleꢀwithꢀvacuumꢀpickꢀ&ꢀplace  
AllꢀpartsꢀareꢀPb-freeꢀandꢀcomplyꢀwithꢀEUꢀDirecꢁveꢀ2011/65/EUꢀamendedꢀbyꢀ(EU)ꢀ2015/863ꢀ(RoHS3)  
Description  
The Z-form option allows conversion of axial through-hole resistors into a surface mount format. This makes available to desigenrs  
of SMD circuits resistors with characteristics that are simply not available in flat chip or MELF styles. For example, powersrisetors with  
ratings up to 5W which dissipate their heat into the air can now be surface mounted - a valuable alternative to an array of eseravl  
chip resistors which dump heat into the PCB. Precision metal film parts are available that give combinations of power rating dan  
stability that are not available in thin film chips. And several of Welwyn's fusible and high-voltage axials are also now surface mountable,  
together with parts bearing UL recognition, CECC release or customer approvals.  
Physical Data  
Dimensions (mm)  
W
I
Size  
Code  
2W  
H
L
W
H max  
I
w
D nom  
L
13.4 0.2  
See  
6.25  
6.9  
See  
4.5 0.6  
6.5 0.6  
0.8  
0.8  
0.8  
w
3W  
18.7 0.2 product  
18.7 0.2 datasheet  
product  
d
5W  
7.9  
datasheet 6.5 0.6  
Recommended Pad Sizes  
Dimensions (mm)  
B
C
D
A min  
5.5  
B min  
2.5  
C max  
10  
D min  
15  
Size Code  
2W  
A
3W  
7.5  
2.5  
15  
20  
5W  
7.5  
2.5  
15  
20  
Application Notes  
Z-form resistors are supplied in reeled blister tape for use on a vacuum pick &  
place system. A standard flat or MELF nozzle may be used provided the placement  
speed is consistent with the mass of the component. Note that, as the format  
is designed to give spacing between the underside of the body and the PCB,  
these parts are not suitable for adhesive attachment during soldering.  
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
www.ttelectronics.com/resistors  
© TT Electronics plc  
07.21  

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