ZE1.3C
SILICON PLANAR POWER ZENER DIODES
Features
• Glass passivated chip
• Built-in strain relief
• Low inductance
• High peak reverse power dissipation
• Low reverse leakage
• For use in stabilizing and clipping with high power rating
Mechanical Data
• Case: DO-41 Molded plastic
• Lead: Solderable per MIL-STD-750, method 2026
• Epoxy: UL 94V-0 rate flame retardant
• Polarity: Color band denotes cathode end
• Mounting position: Any
Absolute Maximum Ratings (Ta = 25℃)
Parameter
Symbol
Ptot
Value
Unit
W
1)
Power Dissipation
TL = 75℃
1.3
Tj
Junction Temperature Range
Storage Temperature Range
- 55 to + 150
- 55 to + 150
℃
℃
TStg
Characteristics at Ta = 25℃
Parameter
Symbol
RθJL
Max.
58
Unit
Thermal Resistance Junction to Lead 1)
℃/W
1) TL= Lead temperature at 3/8'' (9.5mm)from body.
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Dated: 13/12/2022 SZ Rev: 01