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YFS-30-03-H-03-SB-TR PDF预览

YFS-30-03-H-03-SB-TR

更新时间: 2024-11-21 08:00:59
品牌 Logo 应用领域
申泰 - SAMTEC /
页数 文件大小 规格书
2页 801K
描述
IC Socket, BGA90, 90 Contact(s),

YFS-30-03-H-03-SB-TR 数据手册

 浏览型号YFS-30-03-H-03-SB-TR的Datasheet PDF文件第2页 
REVISION H  
YFS-XX-X3-X-XX-XSB-XX  
(No OF POS x .0500[1.270]) + .120[3.05] REF  
(No OF POS x .0500[1.270]) + .020[.51] REF  
OPTION  
-K: KAPTON PAD  
(SEE FIG. 2, SHT. 2)  
-TR: TAPE & REEL  
No OF POSITIONS  
-20, -30, -40, -50  
DO NOT  
SCALE FROM  
THIS PRINT  
C1  
(PER ROW)  
((No OF POS -1) x .0500[1.270]))  
.035 0.89 REF  
SOLDER BALLS  
-SB: SOLDER BALL  
.0020[.051]  
"B"  
LEAD STYLE  
(USE SDB-030-6337)  
-MSB: MODIFIED SOLDER BALL  
(USE SDB-030-9653, Pb  
-03: PIN / SOLDERBALLS  
(USE C-140-03-X, SEE FIG. 1)  
-L3: PIN / SOLDERBALLS  
(LOW INSERTION FORCE)  
(USE C-226-03-X)  
*
H
FREE,SEE NOTE 14)  
"A" EQ SPACES  
@ .0500[1.270]  
ROW SPECIFICATION  
"B"  
REF  
.145 3.68  
REF  
-05: FIVE (USE YFSP-XX-01-F)  
-08: EIGHT (USE YFSP-XX-01-E)  
-10: TEN (USE YFSP-XX-01-T)  
-06: SIX (USE YFSP-XX-01-6)  
(AVAILABLE IN 20 POS. ONLY)  
-03: THREE (USE YFSP-XX-01-3)  
(AVAILABLE IN 20 POS. ONLY)  
PLATING SPECIFICATION  
-G: GOLD (USE C-XXX-03-G)  
(SEE NOTE 7)  
-H: HEAVY GOLD (USE C-XXX-03-H)  
-E: EXTRA GOLD (USE C-XXX-03-E)  
(SEE NOTE 7)  
"A"  
"A"  
02  
"B"  
01  
* = NOT ENGINEERING APPROVED  
09 (PIN # = NO. OF ROWS +1)  
C-XXX-03-X  
YFSP-XX-01-X  
SEE NOTE 6  
NOTES:  
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
.134±.003 3.41±0.08  
2. NOTE DELETED.  
3. BURR ALLOWANCE: .0005[0.013] MAX.  
4. MINIMUM PUSHOUT FORCE: .5 LB.  
5. NOTE DELETED.  
.104 2.64  
REF  
6. CONTACT TO BE FLUSH .002[0.05] RECESSED.  
7. ONE REEL MINIMUM PLATING REQUIREMENT  
(85,000 CONTACTS PER REEL)  
8. ALL DIMS TO BE SYMMETRICAL ABOUT THE  
CENTERLINE WITHIN .001[0.03].  
9. .0025[0.064] MAX VARIATION BETWEEN  
SOLDERBALLS.  
'A'  
.012 0.31  
(SEE NOTE 9)  
SECTION "B"-"B"  
SECTION "A"-"A"  
SDB-030-XXXX  
10. REFER TO VISUAL INSPECTION BOARD FOR  
SOLDERBALL APPEARANCE CHECKS.  
11. THE DISTANCE FROM THE CENTER OF ANY  
SOLDERBALL TO THE CENTER OF ANY  
ADJACENT INNER PEG SHALL BE  
.025 .005[0.64 0.13].  
12. SOLDER JOINTS TO BE INSPECTED PER IPC  
SPECIFICATION 12.2.12 (IPC-A-610C).  
13. NOTE DELETED  
14. CONTACT SAMTEC CES DEPARTMENT FOR  
PROCESSING INFORMATION.  
.095 2.41  
REF  
H
PROPRIETARY NOTE  
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN INCHES.  
TOLERANCES ARE:  
IN-PROCESS WITHOUT SOLDERBALLS  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
DECIMALS  
ANGLES  
2
.XX: .01[.3]  
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
.XXX: .005[.13]  
PHONE: 812-944-6733  
FAX: 812-948-5047  
.XXXX: .0020[.051]  
e-Mail info@SAMTEC.com  
code 55322  
SHEET SCALE: 2.5:1  
DO NOT SCALE DRAWING  
DESCRIPTION:  
MATERIAL:  
.050[1.27] MULTI-ROW SOCKET ASM.  
YFS-XX-X3-X-XX-XSB-XX  
INSULATOR: LCP, COLOR: BLACK  
CONTACT: PHOS BRONZE  
DWG. NO.  
DETAIL 'A'  
SCALE 5 : 1  
KEVIN B  
4/22/99  
SHEET 1 OF 2  
BY:  
F:\dwg\misc\mktg\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW  

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