Datasheet > YFS-30-03-G-10-MSB-K

YFS-30-03-G-10-MSB-K

更新时间： 2024-11-21 05:30:31

品牌	Logo	应用领域
申泰 - SAMTEC		/
页数	文件大小	规格书
2页	751K
描述
IC Socket, BGA300, 300 Contact(s),

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数据手册

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YFS-30-03-G-10-MSB-K 数据手册

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REVISION Q

YFS-XX-X3-X-XX-XSB-XX

"F" REF

OPTION

"G" REF

No OF POSITIONS

-K: KAPTON PAD

(SEE FIG 2, SHT 2)

-TR: TAPE & REEL

(SEE NOTE 17)

-20, -30, -40, -50

DO NOT

(PER ROW)

SCALE FROM

THIS PRINT

((No OF POS -1) x .0500[1.270]))

.035 0.89 REF

.0020[.051]

"B"

SOLDER BALLS

LEAD STYLE

-SB: SOLDER BALL

-03: PIN / SOLDERBALLS

(USE C-140-03-X, SEE FIG 1)

-L3: PIN / SOLDERBALLS

(LOW INSERTION FORCE)

(USE C-226-03-X)

(USE SDB-030-6337)

37% Pb/63% Sn

* -MSB: MODIFIED SOLDER BALL

(USE SDB-030-9653, Pb

FREE,SEE NOTE 14)

"A"

"B"

REF

.145 3.68

REF

PLATING SPECIFICATION

96.5% S/3% Ag/0.5% Cu

-G: GOLD (USE C-XXX-03-G)

(SEE NOTE 7)

"A"

ROW SPECIFICATION

-H: HEAVY GOLD (USE C-XXX-03-H)

-E: EXTRA GOLD (USE C-XXX-03-E)

(SEE NOTE 7)

-05: FIVE (USE YFSP-XX-01-F)

-08: EIGHT (USE YFSP-XX-01-E)

-10: TEN (USE YFSP-XX-01-T)

-06: SIX (USE YFSP-XX-01-6)

(AVAILABLE IN 20 POS ONLY)

-03: THREE (USE YFSP-XX-01-3)

(AVAILABLE IN 20 POS ONLY)

(SEE NOTE 17)

"A"

"B"

YFSP-XX-01-X

09 (PIN # = NO. OF ROWS +1)

C-XXX-03-X

* = NOT ENGINEERING APPROVED

'A'

.134±.003 3.41±0.08

.104 2.64

REF

.012 0.312

(SEE NOTE 9)

SDB-030-XXXX

SECTION "B"-"B"

NOTES:

REPRESENTS A CRITICAL DIMENSION.

2. NOTE DELETED.

SECTION "A"-"A"

3. MAXIMUM BURR ALLOWANCE: .0005[0.013]

4. MINIMUM PUSHOUT FORCE: .5 LB.

5. NOTE DELETED.

6. CONTACT TO BE FLUSH .002[0.05].

TO BE MEASURED AT ALL FOUR CORNERS.

7. ONE REEL MINIMUM PLATING REQUIREMENT

(85,000 CONTACTS PER REEL)

8. ALL DIMS TO BE SYMMETRICAL ABOUT THE

CENTERLINE WITHIN .001[0.03].

9. .0025[0.064] MAX VARIATION BETWEEN

SOLDERBALLS.

.095 2.41

REF

10. REFER TO VISUAL INSPECTION BOARD FOR

SOLDERBALL APPEARANCE CHECKS.

11. THE DISTANCE FROM THE CENTER OF ANY

SOLDERBALL TO THE CENTER OF ANY

ADJACENT INNER PEG SHALL BE

.025 .005[0.64 0.13].

12. NOTE DELETED.

13. NOTE DELETED.

14. CONTACT SAMTEC CES DEPARTMENT FOR

PROCESSING INFORMATION.

FIG 1

15. NOTE DELETED.

16. NO FLASH ALLOWED ON THE PIN TIPS.

17. IF -TR OPTION IS NOT SPECIFIED, PARTS TO BE

PACKAGED IN TRAYS. PARTS WITH -03 ROW

SPECIFICATION NOT VALID WITHOUT -TR OPTION.

YFS-20-X3-X-08-XSB SHOWN

IN-PROCESS WITHOUT SOLDERBALLS

PROPRIETARY NOTE

UNLESS OTHERWISE SPECIFIED,

DIMENSIONS ARE IN INCHES.

TOLERANCES ARE:

THIS DOCUMENT CONTAINS INFORMATION

CONFIDENTIAL AND PROPRIETARY TO

SEE NOTE 6

SAMTEC, INC. AND SHALL NOT BE REPRODUCED

OR TRANSFERRED TO OTHER DOCUMENTS OR

DISCLOSED TO OTHERS OR USED FOR ANY

PURPOSE OTHER THAN THAT WHICH IT WAS

OBTAINED WITHOUT THE EXPRESSED WRITTEN

CONSENT OF SAMTEC, INC.

DECIMALS

ANGLES

.XX: .01[.3]

520 PARK EAST BLVD, NEW ALBANY, IN 47150

.XXX: .005[.13]

PHONE: 812-944-6733

FAX: 812-948-5047

code 55322

.XXXX: .0020[.051]

e-Mail info@SAMTEC.com

SHEET SCALE: 2.5:1

DO NOT SCALE DRAWING

DESCRIPTION:

MATERIAL:

.050[1.27] MULTI-ROW SOCKET ASSEMBLY

DWG. NO.

INSULATOR: LCP, COLOR: BLACK

CONTACT: PHOS BRONZE

DETAIL 'A'

SCALE 5 : 1

YFS-XX-X3-X-XX-XSB-XX

SEE NOTE 16

BY:

KEVIN B

4/22/99

SHEET 1 OF 2

F:\DWG\MISC\MKTG\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW

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与YFS-30-03-G-10-MSB-K相关器件

型号	品牌	获取价格	描述	数据表
YFS-30-03-G-10-MSB-TR	SAMTEC	获取价格	IC Socket, BGA300, 300 Contact(s),
YFS-30-03-G-10-SB-K	SAMTEC	获取价格	IC Socket, BGA300, 300 Contact(s),
YFS-30-03-G-10-SB-TR	SAMTEC	获取价格	IC Socket, BGA300, 300 Contact(s),
YFS-30-03-G-T-SB-TR	SAMTEC	获取价格	IC Socket, BGA300, 300 Contact(s),
YFS-30-03-H-03-SB-TR	SAMTEC	获取价格	IC Socket, BGA90, 90 Contact(s),
YFS-30-03-H-05-MSB-K	SAMTEC	获取价格	IC Socket, BGA150, 150 Contact(s),
YFS-30-03-H-05-MSB-TR	SAMTEC	获取价格	IC Socket, BGA150, 150 Contact(s),
YFS-30-03-H-05-SB	SAMTEC	获取价格	Board Connector, 150 Contact(s), 5 Row(s), Female, Straight, Surface Mount Terminal, Socke
YFS-30-03-H-05-SB-K	SAMTEC	获取价格	IC Socket, BGA150, 150 Contact(s),
YFS-30-03-H-06-MSB-TR	SAMTEC	获取价格	IC Socket, BGA180, 180 Contact(s),

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