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YFS-20-03-H-05-SB-K PDF预览

YFS-20-03-H-05-SB-K

更新时间: 2024-11-20 15:58:43
品牌 Logo 应用领域
申泰 - SAMTEC /
页数 文件大小 规格书
2页 748K
描述
IC Socket, BGA100, 100 Contact(s),

YFS-20-03-H-05-SB-K 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8536.69.40.40
风险等级:1.35其他特性:LOW PROFILE, TIGER EYE CONTACT
联系完成配合:GOLD (30) OVER NICKEL (50)联系完成终止:Gold (Au) - with Nickel (Ni) barrier
触点材料:PHOSPHOR BRONZE设备插槽类型:IC SOCKET
使用的设备类型:BGA100外壳材料:LIQUID CRYSTAL POLYMER
JESD-609代码:e4触点数:100
Base Number Matches:1

YFS-20-03-H-05-SB-K 数据手册

 浏览型号YFS-20-03-H-05-SB-K的Datasheet PDF文件第2页 
REVISION R  
R
YFS-XX-X3-X-XX-SB-XX  
"F" REF  
"G" REF  
OPTION  
No OF POSITIONS  
-20, -30, -40, -50  
(PER ROW)  
-K: KAPTON PAD  
(SEE FIG 2, SHT 2)  
-TR: TAPE & REEL  
(SEE NOTE 17)  
DO NOT  
SCALE FROM  
THIS PRINT  
C3-A-MV  
C
((No OF POS -1) x .0500[1.270]))  
.035 0.89 REF  
.0020[.051]  
"B"  
SOLDER BALLS  
C1-B,I-XR  
LEAD STYLE  
-SB: SOLDER BALL  
-03: PIN / SOLDERBALLS  
(USE C-140-03-X, SEE FIG 1)  
-L3: PIN / SOLDERBALLS  
(LOW INSERTION FORCE)  
(USE C-226-03-X)  
(USE SDB-030-6337)  
37% Pb/63% Sn  
"A"  
"B"  
REF  
.145 3.68  
REF  
PLATING SPECIFICATION  
-G: GOLD (USE C-XXX-03-G)  
(SEE NOTE 7)  
-H: HEAVY GOLD (USE C-XXX-03-H)  
-E: EXTRA GOLD (USE C-XXX-03-E)  
(SEE NOTE 7)  
"A"  
ROW SPECIFICATION  
-05: FIVE (USE YFSP-XX-01-F)  
-08: EIGHT (USE YFSP-XX-01-E)  
-10: TEN (USE YFSP-XX-01-T)  
-06: SIX (USE YFSP-XX-01-6)  
(AVAILABLE IN 20 POS ONLY)  
-03: THREE (USE YFSP-XX-01-3)  
(AVAILABLE IN 20 POS ONLY)  
(SEE NOTE 17)  
02  
"A"  
"B"  
01  
YFSP-XX-01-X  
09 (PIN # = NO. OF ROWS +1)  
C-XXX-03-X  
'A'  
C5-B-DC  
.134±.003 3.41±0.08  
.104 2.64  
REF  
.012 0.312  
(SEE NOTE 9)  
SDB-030-XXXX  
SECTION "B"-"B"  
NOTES:  
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
2. NOTE DELETED.  
SECTION "A"-"A"  
3. MAXIMUM BURR ALLOWANCE: .0005[0.013]  
4. MINIMUM PUSHOUT FORCE: .5 LB.  
5. NOTE DELETED.  
6. CONTACT TO BE FLUSH .002[0.05].  
TO BE MEASURED AT ALL FOUR CORNERS.  
7. ONE REEL MINIMUM PLATING REQUIREMENT  
(85,000 CONTACTS PER REEL)  
8. ALL DIMS TO BE SYMMETRICAL ABOUT THE  
CENTERLINE WITHIN .001[0.03].  
9. .0025[0.064] MAX VARIATION BETWEEN  
SOLDERBALLS.  
C2-B,I-MV  
.095 2.41  
REF  
10. REFER TO VISUAL INSPECTION BOARD FOR  
SOLDERBALL APPEARANCE CHECKS.  
11. THE DISTANCE FROM THE CENTER OF ANY  
SOLDERBALL TO THE CENTER OF ANY  
ADJACENT INNER PEG SHALL BE  
.025 .005[0.64 0.13].  
12. NOTE DELETED.  
13. NOTE DELETED.  
14. NOTE DELETED.  
R
15. NOTE DELETED.  
FIG 1  
16. NO FLASH ALLOWED ON THE PIN TIPS.  
17. IF -TR OPTION IS NOT SPECIFIED, PARTS TO BE  
PACKAGED IN TRAYS. PARTS WITH -03 ROW  
SPECIFICATION NOT VALID WITHOUT -TR OPTION.  
YFS-20-X3-X-08-SB SHOWN  
C4-B-VS  
R
IN-PROCESS WITHOUT SOLDERBALLS  
PROPRIETARY NOTE  
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN INCHES.  
TOLERANCES ARE:  
CRITICAL DIMENSION INSPECTION INSTRUCTION  
TABLE  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
SEE NOTE 6  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
DECIMALS  
ANGLES  
2
.XX: .01[.3]  
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
ASSEMBLY OPERATION IN-PROCESS INSPECTION  
.XXX: .005[.13]  
PHONE: 812-944-6733  
FAX: 812-948-5047  
code 55322  
.XXXX: .0020[.051]  
e-Mail info@SAMTEC.com  
FILL C-XXX-XX-X  
C2, C3  
C3, C4  
C5  
SHEET SCALE: 2.5:1  
DO NOT SCALE DRAWING  
DESCRIPTION:  
MATERIAL:  
.050[1.27] MULTI-ROW SOCKET ASSEMBLY  
DWG. NO.  
ATTACH SDB-XXX-XXXX  
REPRESS SOLDER BALL  
INSULATOR: LCP, COLOR: BLACK  
CONTACT: PHOS BRONZE  
DETAIL 'A'  
SCALE 5 : 1  
YFS-XX-X3-X-XX-SB-XX  
SEE NOTE 16  
FINISHED GOOD  
INSPECTION  
C1, C2, C3, C5  
KEVIN B  
4/22/99  
SHEET 1 OF 2  
BY:  
F:\DWG\MISC\MKTG\YFS-XX-X3-X-XX-SB-XX-MKT.SLDDRW  

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