Datasheet > XW180GC34B

XW180GC34B

更新时间： 2024-11-19 14:56:47

品牌	Logo	应用领域
力特 - LITTELFUSE		半导体
页数	文件大小	规格书
6页	652K
描述
为了使半导体设备在运行过程中能够正确冷却，我们提供全系列铜和铝水冷块。该设计既可以在夹紧过程中正确分配力，也能确保操作过程中冷却设备所需的流量。如要了解其他详细技术信息，请联系支持部门。

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XW180GC34B 数据手册

Water Cooled Heatsink Type XW180GC34#

Date: - 1^stJune, 2017

Data Sheet Issue: - 3

Water Cooled Heatsink

Type XW180GC34#

Characteristics – Double side cooling, 2 coolers + 1 Semiconductor

PARAMETER

TYP. TEST CONDITIONS

UNITS

R_{th (C/W)}Cooler-input water thermal resistance

2.55 6l/m flow rate, Power – 2.5kW

1.95 10l/m flow rate, Power – 2.5kW

K/kW

Characteristics – Double side cooling, 3 coolers + 2 Semiconductors

PARAMETER

TYP. TEST CONDITIONS

UNITS

R_{th (C/W)}Cooler-input water thermal resistance

3.25 6l/m flow rate, Power – 2.5kW

K/kW

2.4

10l/m flow rate, Power – 2.5kW

Physical/Electrical properties

PARAMETER

MIN.

TYP. MAX. TEST CONDITIONS UNITS

Pressure difference between input and

output water per cooler

Pressure difference between input and

output water per cooler

6l/m

kPa

P

140

10l/m

P

Mass without busbar (XW180GC34A)

Mass with busbar (XW180GC34B)

Dimensions

4.92

5.89

See outline drawing

Mechanical properties

PARAMETER

MIN.

TYP. MAX. UNITS

Flatness of contact area

0.8

m

Roughness of contact area

Clamping force

N/mm²

Finish of contact area

Hydraulic fitting

Nickel-plating 10m bright

3/8” BSPP

* For other busbar/mechanical configurations please consult the factory.

12 3 4 5 6

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