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XTR108TDD1 PDF预览

XTR108TDD1

更新时间: 2024-02-25 07:05:35
品牌 Logo 应用领域
德州仪器 - TI 模拟IC信号电路
页数 文件大小 规格书
5页 120K
描述
TWO-WIRE TRANSMITTER

XTR108TDD1 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:DIE-27Reach Compliance Code:not_compliant
Factory Lead Time:24 weeks风险等级:5.86
Is Samacsys:N模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-XUUC-N27长度:3.09 mm
功能数量:1端子数量:27
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED表面贴装:YES
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:2.142 mm
Base Number Matches:1

XTR108TDD1 数据手册

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XTR108-DIE  
www.ti.com  
SBOS615 JUNE 2012  
TWO-WIRE TRANSMITTER  
"SMART" PROGRAMMABLE WITH SIGNAL CONDITIONING  
1
FEATURES  
Complete Transmitter + RTD Linearization  
APPLICATIONS  
Two-Wire Output  
Remote RTD Transmitters  
Pressure Bridge Transmitters  
Strain Gate Transmitters  
Eliminates Potentiometers and Trimming  
Digitally Calibrated  
Serial SPI Bus Interface  
SCADA Remote Data Acquisition  
Weighing Systems  
Industrial Process Control  
DESCRIPTION  
The XTR108 is a “smart” programmable, two-wire transmitter designed for temperature and bridge sensors. Zero,  
span, and linearization errors in the analog signal path can be calibrated via a standard digital serial interface,  
eliminating manual trimming. Non-volatile external EEPROM stores calibration settings.  
The all-analog signal path contains an input multiplexer, autozeroed programmable-gain instrumentation  
amplifier, dual programmable current sources, linearization circuit, voltage reference, sub-regulator, internal  
oscillator, control logic, and an output current amplifier. Programmable level shifting compensates for sensor DC  
offsets. Selectable up- and down-scale output indicates out-of-range and burnout per NAMUR NE43. Automatic  
reset is initiated when supply is lost.  
Current sources, steered through the multiplexer, can be used to directly excite RTD temperature sensors,  
pressure bridges, or other transducers. An uncommitted operational amplifier can be used to convert current into  
a voltage.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE(2)  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
XTR108TDD1  
XTR108TDD2  
130  
10  
XTR108  
TD  
Bare die in waffle pack  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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