Datasheet > XRAG2-SBN18I/1GI

XRAG2-SBN18I/1GI

更新时间： 2024-11-21 14:45:43

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		电信电信集成电路
页数	文件大小	规格书
33页	370K
描述
SPECIALTY TELECOM CIRCUIT, UUC, WAFER

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中文翻译

获取价格

技术参数
数据手册

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XRAG2-SBN18I/1GI 技术参数

生命周期：	Obsolete	零件包装代码：	WAFER
包装说明：	WAFER	Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01	风险等级：	5.84
Is Samacsys：	N	JESD-30 代码：	X-XUUC-N
功能数量：	1	最高工作温度：	55 °C
最低工作温度：	-20 °C	封装主体材料：	UNSPECIFIED
封装代码：	DIE	封装等效代码：	DIE OR CHIP
封装形状：	UNSPECIFIED	封装形式：	UNCASED CHIP
认证状态：	Not Qualified	子类别：	Other Telecom ICs
表面贴装：	YES	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	OTHER	端子形式：	NO LEAD
端子位置：	UPPER	Base Number Matches：	1

XRAG2-SBN18I/1GI 数据手册

XRAG2

432-bit UHF, EPCglobal Class1 Generation2 and ISO 18000-6C,

contactless memory chip with user memory

Features

■ EPCglobal class 1 generation 2 RFID UHF

specification (revision 1.0.9)

■ Passive operation (no battery required)

■ UHF carrier frequencies from 860 MHz to

UFDFPN6⁽¹⁾

960 MHz ISM band

1.8 × 2 mm (MA)

■ To the XRAG2:

– Asynchronous 90% SSB-ASK, DSB-ASK

or PR-ASK modulation using pulse interval

encoding (Up to 128Kbit/s)

■ From the XRAG2:

– Backscattered reflective answers using

FM0 or Miller bit coding (up to 640 Kbits/s)

■ 432-bit memory with two possible

configurations:

– 3 memory banks to store up to 256-bit EPC

code: 64-bit TID, 304-bit EPC and 64-bit

reserved banks

Unsawn unbumped wafers

sawn and bumped wafers

– 4 memory banks to store up to 128-EPC

code: 128-bit user, 64-bit TID, 176-bit EPC

and 64-bit reserved banks

■ Supports EPC and ISO TID

■ Multisession protocol

1. Preliminary data.

■ Anti-collision functionality

■ Inventory, Read, Write and Erase features

■ Kill command

■ 100 ms programming time (max) for 288-bit

(EPC code, Protocol Control bits and CRC16)

programming

■ More than 10,000 Write/Erase cycles

■ More than 40 years’ data retention

■ Packages

– ECOPACK® (RoHS compliant)

April 2008

Rev 6

1/33

www.st.com

12 3 4 5 6 7...33

中文翻译

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