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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| XRA530DN | HONEYWELL |
获取价格 |
Peizoresistive Sensor, Differential, 0Psi Min, 30Psi Max, 3.5-8.5V, Rectangular, Through H |
|
| XRA560DN | HONEYWELL |
获取价格 |
Peizoresistive Sensor, Differential, 0Psi Min, 60Psi Max, 3.5-8.5V, Rectangular, Through H |
|
| XRAG2 | STMICROELECTRONICS |
获取价格 |
432-bit UHF, EPCglobal Class1 Generation2 and ISO 18000-6C, contactless memory chip with u |
|
| XRAG2_08 | STMICROELECTRONICS |
获取价格 |
432-bit UHF, EPCglobal Class1 Generation2 and ISO 18000-6C, contactless memory chip with u |
|
| XRAG2-MATG/1GE | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, PDSO6, 1.80 X 2 MM, ROHS COMPLIANT, MLP-6 |
|
| XRAG2-MATG/1GI | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, PDSO6, 1.80 X 2 MM, ROHS COMPLIANT, MLP-6 |
|
| XRAG2-SBN18I | STMICROELECTRONICS |
获取价格 |
UHF, EPCglobal Class-1 Generation-2, Contactless Memory Chip 432 bit with Multi-session Pr |
|
| XRAG2-SBN18I/1GE | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, UUC, WAFER |
|
| XRAG2-SBN18I/1GI | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, UUC, WAFER |
|
| XRAG2-W41/1GE | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, UUC, WAFER |
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意法半导体发布第四代SiC技术，助力电动汽车电驱
联发科推出全球首款3纳米汽车芯片CT-X1，挑战高通SA8295
国家大基金减持三家半导体企业，市场反应各异
晶圆厂易主：Coherent公司2000万英镑出售苹果供应链关键资产
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