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XFL4012-601 PDF预览

XFL4012-601

更新时间: 2023-12-06 20:02:32
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线艺 - COILCRAFT /
页数 文件大小 规格书
2页 170K
描述
Ultra-Low DCR Shielded Power Inductors

XFL4012-601 数据手册

 浏览型号XFL4012-601的Datasheet PDF文件第2页 
Web  
page  
Sample  
& buy  
Tools &  
software  
Support  
& FAQ  
Document 935-1  
Shielded Power Inductors  
XFL4012  
Halogen  
Free  
• High current ratings and low DCR  
• Very low profile, only 1.2 mm high  
Designer’s Kit C455 contains 5 of each XFL4012 and XFL4015 value.  
Core material Composite  
Weight 85 – 95 mg  
AEC  
+
Q200 125°C  
Operating voltage 0 – 20 V  
Environmental RoHS compliant, halogen free  
Terminations RoHS compliant tin-silver (96.5/3.5) over copper.  
Other terminations available at additional cost.  
Ambient temperature –40°C to +125°C with (40°C rise) Irms current.  
Maximum part temperature +165°C (ambient + temp rise). Derating.  
Storage temperature Component: –55°C to +165°C.  
Tape and reel packaging: –55°C to +80°C  
Resistance to soldering heat Max three 40 second reflows at  
+260°C, parts cooled to room temperature between cycles  
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /  
85% relative humidity)  
Packaging 1500/7reel; 5000/13reel Plastic tape: 12 mm wide,  
0.23 mm thick, 8 mm pocket spacing, 1.40 mm pocket depth  
PCB washing Tested to MIL-STD-202 Method 215 plus an additional  
aqueous wash. See Doc787_PCB_Washing.pdf.  
DCR (mOhms)3  
Isat (A)5  
Irms (A)6  
±2°C rise 42°C rise  
Inductance2  
±±20 (ꢀµ)  
SRF typ4  
(Mµz)  
Part number1  
typ  
max  
120 drop ±20 drop 320 drop  
XFL4012-121ME_  
XFL4012-251ME_  
XFL4012-471ME_  
XFL4012-601ME_  
0.12  
0.25  
0.47  
0.60  
5.20  
7.64  
14.07  
17.40  
5.88  
8.40  
15.48  
19.14  
220  
150  
115  
95.0  
6.9  
4.4  
3.2  
2.8  
9.8  
7.7  
5.5  
5.0  
11.3  
9.7  
6.7  
6.5  
9.60  
8.15  
6.25  
5.45  
13.20  
11.45  
8.70  
7.65  
1. When ordering, please specify termination and packaging codes:  
XFL421±-621MEC  
Termination: E = RoHS compliant tin-silver over copper.  
Special order:  
Irms Testing  
Irms testing was performed on  
0.75 inch wide × 0.25 inch thick  
copper traces in still air.  
T = RoHS tin-silver-copper (95.5/4/0.5) or  
S = non-RoHS tin-lead (63/37).  
Temperature rise is highly  
dependent on many factors  
including pcb land pattern,  
trace size, and proximity to  
other components. Therefore  
temperature rise should be  
verified in application conditions.  
Packaging: C = 7machine-ready reel. EIA-481 embossed plastic tape (1500 parts per full reel). Quantities  
less than full reel available: in tape (not machine ready) or with leader and trailer ($25 charge).  
B = Less than full reel. In an effort to simplify our part numbering system, Coilcraft is eliminating  
the need for multiple packaging codes. When ordering, simply change the last letter of your  
part number from B to C.  
D = 13machine-ready reel. EIA-481 embossed plastic tape. Factory order only, not stocked  
(5000 parts per full reel).  
2. Inductance tested at 1 MHz, 0.1 Vrms, 0 Adc.  
3. DCR measured on a micro-ohmmeter.  
4. SRF measured using Agilent/HP 4395A or equivalent.  
5. DC current at 25°C that causes the specified inductance drop from its value without current. Click for  
temperature derating information.  
6. Current that causes the specified temperature rise from 25°C ambient.This information is for reference only  
and does not represent absolute maximum ratings. Click for temperature derating information.  
7. Electrical specifications at 25°C.  
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.  
Document 935-1 Revised 11/24/21  
US +1-847-639-6400 sales@coilcraft.com  
UK +44-1236-730595 sales@coilcraft-europe.com  
Taiwan +886-2-2264 3646 sales@coilcraft.com.tw  
China +86-21-6218 8074 sales@coilcraft.com.cn  
Singapore + 65-6484 8412 sales@coilcraft.com.sg  
© Coilcraft Inc. 2021  
This product may not be used in medical or high  
risk applications without prior Coilcraft approval.  
Specification subject to change without notice.  
Please check web site for latest information.  

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