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XCR3032XL-5VQ44C PDF预览

XCR3032XL-5VQ44C

更新时间: 2024-11-10 22:12:07
品牌 Logo 应用领域
赛灵思 - XILINX /
页数 文件大小 规格书
8页 85K
描述
XCR3032XL 32 Macrocell CPLD

XCR3032XL-5VQ44C 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:QFP
包装说明:TQFP, TQFP44,.47SQ,32针数:44
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:12 weeks
风险等级:5.12其他特性:YES
最大时钟频率:213 MHz系统内可编程:YES
JESD-30 代码:S-PQFP-G44JESD-609代码:e0
JTAG BST:YES长度:10 mm
湿度敏感等级:3专用输入次数:
I/O 线路数量:36宏单元数:32
端子数量:44最高工作温度:70 °C
最低工作温度:组织:0 DEDICATED INPUTS, 36 I/O
输出函数:MACROCELL封装主体材料:PLASTIC/EPOXY
封装代码:TQFP封装等效代码:TQFP44,.47SQ,32
封装形状:SQUARE封装形式:FLATPACK, THIN PROFILE
峰值回流温度(摄氏度):225电源:3.3 V
可编程逻辑类型:EE PLD传播延迟:5 ns
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:Programmable Logic Devices最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:10 mmBase Number Matches:1

XCR3032XL-5VQ44C 数据手册

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R
XCR3032XL 32 Macrocell CPLD  
0
14  
DS023 (v1.5) January 8, 2002  
Preliminary Product Specification  
Features  
Description  
Lowest power 32 macrocell CPLD  
The XCR3032XL is a 3.3V, 32-macrocell CPLD targeted at  
power sensitive designs that require leading edge program-  
mable logic solutions. A total of two function blocks provide  
750 usable gates. Pin-to-pin propagation delays are 5.0 ns  
with a maximum system frequency of 200 MHz.  
5.0 ns pin-to-pin logic delays  
System frequencies up to 200 MHz  
32 macrocells with 750 usable gates  
Available in small footprint packages  
-
-
-
48-ball CS BGA (36 user I/O pins)  
44-pin VQFP (36 user I/O)  
44-pin PLCC (36 user I/O)  
TotalCMOS Design Technique for Fast  
Zero Power  
Xilinx offers a TotalCMOS CPLD, both in process technol-  
ogy and design technique. Xilinx employs a cascade of  
CMOS gates to implement its sum of products instead of  
the traditional sense amp approach. This CMOS gate imple-  
mentation allows Xilinx to offer CPLDs that are both high  
performance and low power, breaking the paradigm that to  
have low power, you must have low performance. Refer to  
Optimized for 3.3V systems  
-
-
-
Ultra-low power operation  
5V tolerant I/O pins with 3.3V core supply  
Advanced 0.35 micron five layer metal EEPROM  
process  
Fast Zero Power™ (FZP) CMOS design  
technology  
-
Figure 1 and Table 1 showing the I vs. Frequency of our  
CC  
XCR3032XL TotalCMOS CPLD (data taken with two  
resetable up/down, 16-bit counters at 3.3V, 25°C).  
Advanced system features  
-
-
-
-
-
-
-
-
In-system programming  
Input registers  
Predictable timing model  
Up to 23 available clocks per function block  
Excellent pin retention during design changes  
Full IEEE Standard 1149.1 boundary-scan (JTAG)  
Four global clocks  
20  
15  
10  
Eight product term control terms per function block  
Fast ISP programming times  
Port Enable pin for dual function of JTAG ISP pins  
5
0
2.7V to 3.6V supply voltage at industrial temperature  
range  
Programmable slew rate control per macrocell  
Security bit prevents unauthorized access  
0
20  
40  
60  
80 100 120  
140 160 180 200  
Refer to XPLA3 family data sheet (DS012) for  
Frequency (MHz)  
architecture description  
DS023_01_080101  
Figure 1: I vs. Frequency at V = 3.3V, 25°C  
CC  
CC  
Table 1: I vs. Frequency (V = 3.3V, 25°C)  
CC  
CC  
Frequency (MHz)  
0
1
5
10  
20  
50  
100  
200  
20.3  
Typical I (mA)  
0.02  
0.13  
0.54  
1.06  
2.09  
5.2  
10.26  
CC  
© 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.  
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.  
DS023 (v1.5) January 8, 2002  
www.xilinx.com  
1
Preliminary Product Specification  
1-800-255-7778  

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